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mb9b100a series 32 - b it a rm ? cortex ? - m3 fm3 microcontroller cypress semiconductor corporation ? 198 champion court ? san jose , ca 95134 - 1709 ? 408 - 943 - 2600 document number: 002 - 05605 rev. *d revised december 15, 2017 the mb9b100a series are a highly integrated 32 - bit microcontroller that target for high - performance and cost - sensitive embedded control applications. the mb9b100a series are based on the a rm ? cortex ? - m3 processor and on - chip flash memory and sram , and peripheral functions, including motor control timers, adcs and communication interfaces (uart, c sio, i 2 c, lin). the products which are described in this data sheet are placed into type 0 p roduct categories in "fm3 f amily peripheral manual". f eatures 32 - bit a rm ? cortex ? - m3 core ? processor version: r2p0 ? up to 80 mhz frequency operation ? memory protection unit (mpu): improve the reliability of an embedded system ? integrated nested vectored interrupt controller (nvic): 1 nmi ( non - maskable interrupt) and 48 peripheral interrupts and 16 priority levels ? 24 - bit sys tem timer (sys tick): system timer for os task management on - chip memories [flash memory] ? up to 512 k byte ? read cycle: 0 wait - cycle@up to 60 mhz, 2 wait - cycle* above * : instruction pre - fetch buffer is included. s o when cpu access continuously, it becomes 0w ait - cycle ? security function for code protection [sram] this series contain a total of up to 64 kbyte on - chip sram. this is composed of two independent sram(sram0, sram1). sram0 is connected to i - code bus and d - code bus of cortex - m3 core. sram1 is connected to system bus. ? sram0: up to 32 k byte ? sram1: up to 32 k byte multi - function s erial i nterface (max. 8 channels ) ? 4 channels with 16 steps 9bit fifo ( ch.4 - ch.7), 4 channels without fifo ( ch.0 - ch.3) ? operation mode is selectable from the followings for each channel . ? uart ? csio ? lin ? i 2 c [uart] ? full - duplex double buffer ? selection with or without parity supported ? built - in dedicated baud rate generator ? external clock available as a serial clock ? hardware flow control: automatically control the transmission by cts/rt s (only ch.4) ? various error detect functions available (parity errors, framing errors, and overrun errors) [csio] ? full - duplex double buffer ? built - in dedicated baud rate generator ? overrun error detect function available [lin] ? lin protocol rev. 2.1 supported ? full - duplex double buffer ? master/slave mode supported ? lin break field generate (can be changed 13 - 16bit length) ? lin break delimiter generate (can be changed 1 - 4bit length) ? various error detect functions available (parity errors, framing errors, and overrun errors)
document number: 002 - 05605 rev. *d page 2 of 109 mb9b100a series [i 2 c] ? standard - mode (max.100 kbps) / fast - mode (max.400 k bps) supported external bus interface ? supports sram, nor & nand flash device ? up to 8 chip selects ? 8 - /16 - bit data width ? up to 25 - bit address bit ? maximum area size : up to 256 mbytes dma contr oller (8 channels) dma controller has an independent bus for cpu, so cpu and dma controller can process simultaneously. ? 8 independently configured and operated channels ? transfer can be started by software or request from the built - in peripherals ? transfer address area: 32bit(4gbyte) ? transfer mode: block transfer/burst transfer/demand transfer ? transfer data type: byte/half - word/word ? transfer block count: 1 to 16 ? number of transfers: 1 to 65536 a/d converter (max. 16 channels) [ 12 - bit a/d converter ] ? successive approximation register type ? built - in 3unit ? conversion time: 1.0 s@5 v ? priority conversion available (priority at 2 levels) ? scanning conversion mode ? built - in fifo f or conversion data storage ( for scan conversion: 16 steps, for priority conversion: 4 steps) base timer (max. 8 channels) operation mode is selectable from the followings for each channel . ? 16 - bit pwm timer ? 16 - bit ppg timer ? 16 - /32 - bit reload timer ? 16 - /32 - bit pwc timer multi - function t imer (max. 2 unit s ) the multi - function timer is composed of the following blocks. ? 16 - bit free - run timer 3 ch/unit ? input capture 4 ch/unit ? output compare 6 ch/unit ? a/d activati on compare 3 ch/unit ? waveform generator 3 ch/unit ? 16 - bit ppg timer 3 ch/unit the follow ing function can be used to achieve the motor control. ? pwm signal output function ? dc chopper waveform output function ? dead time function ? input capture function ? a/d convertor activate function ? dtif ( motor emergency stop) interrupt function quadrature position /revolution counter (qprc) ( max. 2 unit s ) the quadrature position/revolution counter (qprc) is used to measure the position of the position encoder. moreover, it is possible to use up/down counter. ? the detection edge of the three external event inp ut pins ain, bin and zin is configurable. ? 16 - bit position counter ? 16 - bit revolution counter ? two 16 - bit compare registers dual timer (two 32 - /16bit down counter) the dual timer consists of two programmable 32 - /16 - bit down counters. operation mode is selectable from the followings for each channel . ? free - running ? periodic (=reload) ? one - shot watch counter the watch counter is used for wake up from sleep mode. ? interval timer: up to 64 s ( max . ) @ sub clock: 32.768 khz
document number: 002 - 05605 rev. *d page 3 of 109 mb9b100a series watch dog t imer (2 channels) a watchdo g timer can generate interrupts or a reset when a time - out value is reached. this series consists of two different watchdogs, a " hardware " watchdog and a " software " watchdog. " hardware " watchdog timer is clocked by the built - in low - speed cr oscillator. the refore , hardware" watchdog is active in any low - power consumption modes except stop mode. external interrupt controller unit ? up to 16 external vectors ? include one non - maskable interrupt (nmi) general purpose i/o port this series can use its pins as general - purpose i/o ports when they are not used for external bus or peripherals. moreover, the port relocate function is built in . it can set which i/o port the peripheral function can be allocated. ? capable of pull - up control per pin ? capable of reading pi n level directly ? b uilt - in the port relocate function ? up to 100 high - speed general - purpose i / o ports@1 2 0pin package crc (cyclic redundancy check) accelerator the crc accelerator helps a verify data transmission or storage integrity. ccitt crc16 and ieee - 802.3 crc32 are supported. ? ccitt crc16 generator polynomial: 0x1021 ? ieee - 802.3 crc32 generator polynomial: 0x04c11db7 clock and reset [clocks] five clock sources (2 ext. osc, 2 cr osc, and main pll) that are dynamically selectable. ? main clock: 4 m hz to 48 mhz ? sub clock: 32.768 k hz ? built - in high - speed cr clock : 4 mhz ? built - in low - speed cr clock : 100 khz ? main pll clock [resets] ? reset requests from initx p ins ? power - on reset ? software reset ? watchdog timers reset ? low - voltage detector reset ? clock supervisor reset clock super visor (csv) clocks generated by cr oscillators are used to supervise abnormality of the external clocks. ? external osc clock failure ( clock stop) is detected, reset is asserted. ? external osc frequency anomaly is detect ed, interr upt or reset is asserted. low voltage detector (lvd) this series include 2 - stage monitoring of voltage on the vcc. when the voltage falls below the voltage has been set, low voltage detector generates an interrupt or reset. ? lvd1: error reporting via interr upt ? lvd2: auto - reset operation low - power consumption m ode three low - power consumption modes supported. ? sleep ? timer ? stop debug ? serial wire jtag debug port (swj - dp) ? embedded trace macrocells (etm) provide comprehensive debug and trace facilities. power supply ? vcc = 2.7 v to 5.5 v : correspond to the wide range voltage .
document number: 002 - 05605 rev. *d page 4 of 109 mb9b100a series contents 1. product lineup ................................ ................................ ................................ ................................ ................................ .. 6 2. packages ................................ ................................ ................................ ................................ ................................ ........... 7 3. pin assignment ................................ ................................ ................................ ................................ ................................ . 8 4. list of p in functions ................................ ................................ ................................ ................................ ....................... 11 5. i/o circuit type ................................ ................................ ................................ ................................ ................................ 39 6. handling precautions ................................ ................................ ................................ ................................ ..................... 43 6.1 precautions for product design ................................ ................................ ................................ ................................ ... 43 6.2 precautions for package mounting ................................ ................................ ................................ .............................. 44 6.3 precautions for use environment ................................ ................................ ................................ ................................ 45 7. handling devices ................................ ................................ ................................ ................................ ............................ 46 8. block diagram ................................ ................................ ................................ ................................ ................................ . 48 9. memory si ze ................................ ................................ ................................ ................................ ................................ .... 48 10. memory map ................................ ................................ ................................ ................................ ................................ .... 49 11. pin status in each cpu state ................................ ................................ ................................ ................................ ........ 52 12. electrical characteristics ................................ ................................ ................................ ................................ ............... 57 12.1 absolute maximum ratings ................................ ................................ ................................ ................................ ......... 57 12.2 recommended operating conditions ................................ ................................ ................................ .......................... 59 12.3 dc characteristics ................................ ................................ ................................ ................................ ....................... 60 12.3.1 current rating ................................ ................................ ................................ ................................ ............................... 60 12.3.2 pin characteristics ................................ ................................ ................................ ................................ ....................... 62 12.4 ac characteristics ................................ ................................ ................................ ................................ ....................... 63 12.4.1 main clock input characteristics ................................ ................................ ................................ ................................ .. 63 12.4.2 sub clock input characteristics ................................ ................................ ................................ ................................ ... 64 12.4.3 built - in cr oscillation characteristics ................................ ................................ ................................ .......................... 64 12.4.4 operating conditions of main pll (in the case of using main clock for input of pll) ................................ .................. 65 12.4.5 operating conditions of main pll (in the case of using built - in high speed cr) ................................ ......................... 65 12.4.6 reset input characteristics ................................ ................................ ................................ ................................ .......... 66 12.4.7 power - on reset timing ................................ ................................ ................................ ................................ ................ 66 12.4.8 external bus timing ................................ ................................ ................................ ................................ ..................... 67 12.4.9 base timer input timing ................................ ................................ ................................ ................................ .............. 72 12.4.10 csio/uart timing ................................ ................................ ................................ ................................ .................. 73 12.4.11 external input timing ................................ ................................ ................................ ................................ ................. 81 12.4.12 quadrature position/revolution counter timing ................................ ................................ ................................ ........ 82 12.4.13 i 2 c timing ................................ ................................ ................................ ................................ ................................ .. 84 12.4.14 etm timing ................................ ................................ ................................ ................................ ............................... 85 12.4.15 jtag timing ................................ ................................ ................................ ................................ .............................. 86 12.5 12 - bit a/d converter ................................ ................................ ................................ ................................ .................... 87 12.6 low - voltage detection characteristics ................................ ................................ ................................ ........................ 90 12.6.1 low - voltage detection reset ................................ ................................ ................................ ................................ ....... 90 12.6.2 interrupt of low - voltage detection ................................ ................................ ................................ ............................... 90 12.7 flash memory write/erase characteristics ................................ ................................ ................................ ................. 91 12.7.1 write / erase time ................................ ................................ ................................ ................................ ......................... 91 12.7.2 erase/write cycles and data hold time ................................ ................................ ................................ .......................... 91 12.8 return time from low - power consumption mode ................................ ................................ ................................ ...... 92 12.8.1 return factor: interrupt ................................ ................................ ................................ ................................ ................ 92 12.8.2 return factor: reset ................................ ................................ ................................ ................................ .................... 94
document number: 002 - 05605 rev. *d page 5 of 109 mb9b100a series 13. example of characteristic ................................ ................................ ................................ ................................ .............. 96 14. ordering information ................................ ................................ ................................ ................................ ...................... 98 15. package dimensions ................................ ................................ ................................ ................................ ...................... 99 16. errata ................................ ................................ ................................ ................................ ................................ .............. 102 16.1 part numbers affected ................................ ................................ ................................ ................................ .............. 102 16.2 qualification status ................................ ................................ ................................ ................................ .................... 102 16.3 errata summary ................................ ................................ ................................ ................................ ........................ 102 16.4 errata detail ................................ ................................ ................................ ................................ .............................. 102 16.4.1 timer and stop mode issue ................................ ................................ ................................ ................................ ........ 102 16.4.2 gap between watch counter value and real time at return in timer mode ................................ ........................... 103 17. major changes ................................ ................................ ................................ ................................ .............................. 105 document h istory ................................ ................................ ................................ ................................ ............................... 107 sales, solutions, and legal information ................................ ................................ ................................ ........................... 109
document number: 002 - 05605 rev. *d page 6 of 109 mb9b100a series 1. p roduct l ineup memory size product device mb9bf102na/ra mb9bf104na/ra mb9bf105na/ra mb9bf106na/ra on - chip flash memory 128 kbyte 256 kbyte 384 kbyte 512 kbyte on - chip sram 16 kbyte 32 kbyte 48 kbyte 64 kbyte function product device mb9bf102na mb9bf104na mb9bf105na mb9bf106na mb9bf102ra mb9bf104ra mb9bf105ra mb9bf106ra pin count 100 120 cpu cortex - m3 freq. 80 mhz power supply voltage range 2.7 v to 5.5 v dmac 8 ch external bus interface addr:25 - bit (max.) data:8 - /16 - bit cs:5(max.) support : sram , nor flash addr:25 - bit (max.) data:8 - /16 - bit cs:8(max.) support : sram , nor & nand flash multi - function serial interface (uart/csio/lin/i 2 c) 8 ch (max.) base timer (pwc/ reload timer/pwm/ppg) 8 ch (max.) mf - timer a/d activation compare 3ch. 2 units (max.) input capture 4ch. free - run timer 3ch. output compare 6ch. waveform generator 3ch. ppg 3ch. qprc 2 ch (max.) dual timer 1 unit watch counter 1 unit crc accelerator yes watchdog timer 1 ch(sw) + 1ch(hw) external interrupts 16 pins (max.)+ nmi 1 i/o ports 80 pins (max.) 100 pins (max.) 12 - bit a/d converter 16 ch (3 units) csv (clock super visor) yes lvd (low voltage detector) 2 ch built - in cr high - speed 4 mhz low - speed 100 khz debug function swj - dp/etm note: ? all signals of the peripheral function in each product cannot be allocated by limiting the pins of package. it is necessary to use the port relocate function of the general i/o port according to your function use. see "electrical characteristics 12.4 ac characteristics (12.4.3) built - in cr oscillation characteristics" for accuracy of built - in cr.
document number: 002 - 05605 rev. *d page 7 of 109 mb9b100a series 2. packages product name package mb9bf102na mb9bf104na mb9bf105na mb9bf106na mb9bf102ra mb9bf104ra mb9bf105ra mb9bf106ra lqfp: lqi 100 (0.5 mm pitch) ? - lqfp: lqm 120 (0.5 mm pitch) - ? bga: lbc 112 (0. 8 mm pitch) ? - ? : supported note: ? refer to " package dimensions " for detailed information on each package .
document number: 002 - 05605 rev. *d page 8 of 109 mb9b100a series 3. pin assignment lqi 100 (top view) note : ? the number after the underscore ( " _ " ) in pin names such as xxx_1 and xxx_2 indicates the relocated port number. for these pins, there are multiple pins that provide the same function for the same channel. use the extended port function regi ster (epfr) to select the pin .
document number: 002 - 05605 rev. *d page 9 of 109 mb9b100a series lqm 120 (top view) note : ? the number after the underscore ( " _ " ) in pin names such as xxx_1 and xxx_2 indicates the relocated port number. for these pins, there are multiple pins that provide the same function for the same channel. use the extended port function register (epfr) to select the pin .
document number: 002 - 05605 rev. *d page 10 of 109 mb9b100a series lbc 112 note : ? the number after the underscore ( " _ " ) in pin names such as xxx_1 and xxx_2 indicates the relocated port number. for these pins, there are multiple pins that provide the same function for the same channel. use the extended port function register (epfr) to select the pin .
document number: 002 - 05605 rev. *d page 11 of 109 mb9b100a series 4. list of pin functions list of pin numbers the number after the underscore ( " _ " ) in pin names such as xxx_1 and xxx_2 indicates the relocated port number. for these pins, there are multiple pins that provide the same function for the same channel. use the extended port function register (e pfr) to select the pin . pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 1 b1 1 vcc - 2 c1 2 p50 e h int00_0 ain0_2 sin3_1 rto10_0 (ppg10_0) mdata0 3 c2 3 p51 e h int01_0 bin0_2 sot3_1 (sda3_1) rto11_0 (ppg10_0) mdata1 4 b3 4 p52 e h int02_0 zin0_2 sck3_1 (scl3_1) rto12_0 (ppg12_0) mdata2 5 d1 5 p53 e h sin6_0 tioa1_2 int07_2 rto13_0 (ppg12_0) mdata3 6 d2 6 p54 e i sot6_0 (sda6_0) tiob1_2 rto14_0 (ppg14_0) mdata4
document number: 002 - 05605 rev. *d page 12 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 7 d3 7 p55 e i sck6_0 (scl6_0) adtg_1 rto15_0 (ppg14_0) mdata5 8 d5 8 p56 e h sin1_0 (120pin only) int08_2 dtti1x_0 mcsx7 - - 9 p57 e i sot1_0 (sda1_0) mnale - - 10 p58 e i sck1_0 (scl1_0) mncle - - 11 p59 e h sin7_0 int09_2 mnwex - - 12 p5a e i sot7_0 (sda7_0) mnrex - - 13 p5b e i sck7_0 (scl7_0) 9 e1 14 p30 e h ain0_0 tiob0_1 int03_2 mdata6
document number: 002 - 05605 rev. *d page 13 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 10 e2 15 p31 e h bin0_0 tiob1_1 sck6_1 (scl6_1) int04_2 mdata7 11 e3 16 p32 e h zin0_0 tiob2_1 sot6_1 (sda6_1) int05_2 mdqm0 12 e4 17 p33 e h int04_0 tiob3_1 sin6_1 adtg_6 mdqm1 13 f1 18 p34 e i frck0_0 tiob4_1 mad24 14 f2 19 p35 e h ic03_0 tiob5_1 int08_1 mad23 15 f3 20 p36 e h ic02_0 sin5_2 int09_1 mcsx3 16 g1 21 p37 e h ic01_0 sot5_2 (sda5_2) int10_1 mcsx2 17 g2 22 p38 e h ic00_0 sck5_2 (scl5_2) int11_1
document number: 002 - 05605 rev. *d page 14 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 18 f4 23 p39 e i dtti0x_0 adtg_2 19 g3 24 p3a g i rto00_0 (ppg00_0) tioa0_1 - b2 - vss - 20 h1 25 p3b g i rto01_0 (ppg00_0) tioa1_1 21 h2 26 p3c g i rto02_0 (ppg02_0) tioa2_1 22 g4 27 p3d g i rto03_0 (ppg02_0) tioa3_1 23 h3 28 p3e g i rto04_0 (ppg04_0) tioa4_1 24 j2 29 p3f g i rto05_0 (ppg04_0) tioa5_1 25 l1 30 vss - 26 j1 31 vcc - 27 j4 32 p40 g h tioa0_0 rto10_1 (ppg10_1) int12_1 mad22 28 l5 33 p41 g h tioa1_0 rto11_1 (ppg10_1) int13_1 mad21
document number: 002 - 05605 rev. *d page 15 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 29 k5 34 p42 g i tioa2_0 rto12_1 (ppg12_1) mad20 30 j5 35 p43 g i tioa3_0 rto13_1 (ppg12_1) adtg_7 mad19 - k2 - vss - - j3 - vss - - h4 - vss - 31 h5 36 p44 g i tioa4_0 rto14_1 (ppg14_1) mad18 32 l6 37 p45 g i tioa5_0 rto15_1 (ppg14_1) mad17 33 l2 38 c - 34 l4 39 vss - 35 k1 40 vcc - 36 l3 41 p46 d m x0a 37 k3 42 p47 d n x1a 38 k4 43 initx b c 39 k6 44 p48 e h dtti1x_1 int14_1 sin3_2 mad16 40 j6 45 p49 e i tiob0_0 ic10_1 ain0_1 sot3_2 (sda3_2) mad15
document number: 002 - 05605 rev. *d page 16 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 41 l7 46 p4a e i tiob1_0 ic11_1 bin0_1 sck3_2 (scl3_2) mad14 42 k7 47 p4b e i tiob2_0 ic12_1 zin0_1 mad13 43 h6 48 p4c e i tiob3_0 ic13_1 sck7_1 (scl7_1) ain1_2 mad12 44 j7 49 p4d e i tiob4_0 frck1_1 sot7_1 (sda7_1) bin1_2 mad11 45 k8 50 p4e e h tiob5_0 int06_2 sin7_1 zin1_2 mad10 - - 51 p70 e i tioa4_2 - - 52 p71 e h int13_2 tiob4_2 - - 53 p72 e h sin2_0 int14_2
document number: 002 - 05605 rev. *d page 17 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 - - 54 p73 e h sot2_0 (sda2_0) int15_2 - - 55 p74 e i sck2_0 (scl2_0) 46 k9 56 md1 c d 47 l8 57 md0 c d 48 l9 58 x0 a a 49 l10 59 x1 a b 50 l11 60 vss - 51 k11 61 vcc - 52 j11 62 p10 f k an00 53 j10 63 p11 f l an01 sin1_1 int02_1 - k10 - vss - - j9 - vss - 54 j8 64 p12 f k an02 sot1_1 (sda1_1) mad09 55 h10 65 p13 f k an03 sck1_1 (scl1_1) mad08 56 h9 66 p14 f l an04 sin0_1 int03_1 mcsx1 57 h7 67 p15 f k an05 sot0_1 (sda0_1) mcsx0
document number: 002 - 05605 rev. *d page 18 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 58 g10 68 p16 f k an06 sck0_1 (scl0_1) moex 59 g9 69 p17 f l an07 sin2_2 int04_1 mwex 60 h11 70 avcc - 61 f11 71 avrh - 62 g11 72 avss - 63 g8 73 p18 f k an08 sot2_2 (sda2_2) mdata8 64 f10 74 p19 f k an09 sck2_2 (scl2_2) mdata9 65 f9 75 p1a f l an10 sin4_1 int05_1 ic00_1 mdata10 - h8 - vss - 66 e11 76 p1b f k an11 sot4_1 (sda4_1) ic01_1 mdata11 67 e10 77 p1c f k an12 sck4_1 (scl4_1) ic02_1 mdata12
document number: 002 - 05605 rev. *d page 19 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 68 f8 78 p1d f k an13 cts4_1 ic03_1 mdata13 69 e9 79 p1e f k an14 rts4_1 dtti0x_1 mdata14 70 d11 80 p1f f k an15 adtg_5 frck0_1 mdata15 - - 8 1 p28 e i adtg_4 rto05_1 (ppg04_1) mcsx6 - - 82 p27 e h int02_2 rto04_1 (ppg04_1) mcsx5 - - 83 p26 e i sck2_1 (scl2_1) rto03_1 (ppg02_1) mcsx4 - - 84 p25 e i sot2_1 (sda2_1) rto02_1 (ppg02_1) - b10 - vss - - c9 - vss - - - 85 p24 e h sin2_1 int01_2 rto01_1 (ppg00_1)
document number: 002 - 05605 rev. *d page 20 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 7 1 d10 8 6 p23 e i sck0_0 (scl0_0) tioa7_1 rto00_1 (ppg00_1) 7 2 e8 8 7 p22 e i sot0_0 (sda0_0) tiob7_1 zin1_1 7 3 c11 8 8 p21 e h sin0_0 int06_1 bin1_1 7 4 c10 8 9 p20 e h int05_0 crout ain1_1 75 a11 90 vss - 76 a10 91 vcc - 77 a9 92 p00 e e trstx 78 b9 93 p01 e e tck swclk 79 b11 94 p02 e e tdi 80 a8 95 p03 e e tms swdio 81 b8 96 p04 e e tdo swo 82 c8 97 p05 e f traced0 tioa5_2 sin4_2 int00_1 - d8 - vss -
document number: 002 - 05605 rev. *d page 21 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 83 d9 98 p06 e f traced1 tiob5_2 sot4_2 (sda4_2) int01_1 84 a7 99 p07 e g traced2 adtg_0 sck4_2 (scl4_2) 85 b7 100 p08 e g traced3 tioa0_2 cts4_2 86 c7 101 p09 e g traceclk tiob0_2 rts4_2 87 d7 102 p0a e h sin4_0 int00_2 frck1_0 mad07 88 a6 103 p0b e i sot4_0 (sda4_0) tiob6_1 ic10_0 mad06 89 b6 104 p0c e i sck4_0 (scl4_0) tioa6_1 ic11_0 mad05 90 c6 105 p0d e i rts4_0 tioa3_2 ic12_0 mad04
document number: 002 - 05605 rev. *d page 22 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 91 a5 106 p0e e i cts4_0 tiob3_2 ic13_0 mad03 - d4 - vss - - c3 - vss - 92 b5 107 p0f e j nmix mad02 - - 108 p68 e h sck3_0 (scl3_0) tiob7_2 int12_2 - - 109 p67 e i sot3_0 (sda3_0) tioa7_2 - - 110 p66 e h sin3_0 adtg_8 int11_2 - - 111 p65 e i tiob7_0 sck5_1 (scl5_1) - - 112 p64 e h tioa7_0 sot5_1 (sda5_1) int10_2 93 d6 113 p63 e h int03_0 mad01 - - sin5_1 94 c5 114 p62 e i sck5_0 (scl5_0) adtg_3 mad00 95 b4 115 p61 e i sot5_0 (sda5_0) tiob2_2
document number: 002 - 05605 rev. *d page 23 of 109 mb9b100a series pin no. pin name i/o circuit type pin s tate type lqfp - 100 bga - 112 lqfp - 120 96 c4 116 p60 e h sin5_0 tioa2_2 int15_1 97 a4 117 vcc - 98 a3 118 p80 h o 99 a2 119 p81 h o 100 a1 120 vss -
document number: 002 - 05605 rev. *d page 24 of 109 mb9b100a series list of pin functions the number after the underscore ("_") in pin names such as xxx_1 and xxx_2 indicates the relocated port number. for these pins, there are multiple pins that provide the same function for the same channel. use the extended port function register (epfr) to select the pin. module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 adc adtg_0 a/d converter external trigger input pin . 84 a7 99 adtg_1 7 d3 7 adtg_2 18 f4 23 adtg_3 94 c5 114 adtg_4 - - 8 1 adtg_5 70 d11 80 adtg_6 12 e4 17 adtg_7 30 j5 35 adtg_8 - - 110 an00 a/d converter analog input pin . anxx describes adc ch.xx. 52 j11 62 an01 53 j10 63 an02 54 j8 64 an03 55 h10 65 an04 56 h9 66 an05 57 h7 67 an06 58 g10 68 an07 59 g9 69 an08 63 g8 73 an09 64 f10 74 an10 65 f9 75 an11 66 e11 76 an12 67 e10 77 an13 68 f8 78 an14 69 e9 79 an15 70 d11 80 base timer 0 tioa0_0 base timer ch.0 tioa pin . 27 j4 32 tioa0_1 19 g3 24 tioa0_2 85 b7 100 tiob0_0 base timer ch.0 tiob pin . 40 j6 45 tiob0_1 9 e1 14 tiob0_2 86 c7 101 base timer 1 tioa1_0 base timer ch.1 tioa pin . 28 l5 33 tioa1_1 20 h1 25 tioa1_2 5 d1 5 tiob1_0 base timer ch.1 tiob pin . 41 l7 46 tiob1_1 10 e2 15 tiob1_2 6 d2 6 base timer 2 tioa2_0 base timer ch.2 tioa pin . 29 k5 34 tioa2_1 21 h2 26 tioa2_2 96 c4 116 tiob2_0 base timer ch.2 tiob pin . 42 k7 47 tiob2_1 11 e3 16 tiob2_2 95 b4 115
document number: 002 - 05605 rev. *d page 25 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 base timer 3 tioa3_0 base timer ch.3 tioa pin . 30 j5 35 tioa3_1 22 g4 27 tioa3_2 90 c6 105 tiob3_0 base timer ch.3 tiob pin . 43 h6 48 tiob3_1 12 e4 17 tiob3_2 91 a5 106 base timer 4 tioa4_0 base timer ch.4 tioa pin . 31 h5 36 tioa4_1 23 h3 28 tioa4_2 - - 51 tiob4_0 base timer ch.4 tiob pin . 44 j7 49 tiob4_1 13 f1 18 tiob4_2 - - 52 base timer 5 tioa5_0 base timer ch.5 tioa pin . 32 l6 37 tioa5_1 24 j2 29 tioa5_2 82 c8 97 tiob5_0 base timer ch.5 tiob pin . 45 k8 50 tiob5_1 14 f2 19 tiob5_2 83 d9 98 base timer 6 tioa6_1 base timer ch.6 tioa pin . 89 b6 104 tiob6_1 base timer ch.6 tiob pin . 88 a6 103 base timer 7 tioa7_0 base timer ch.7 tioa pin . - - 112 tioa7_1 71 d10 86 tioa7_2 - - 109 tiob7_0 base timer ch.7 tiob pin . - - 111 tiob7_1 72 e8 87 tiob7_2 - - 108
document number: 002 - 05605 rev. *d page 26 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 debugger swclk serial wire debug interface clock input . 78 b9 93 swdio serial wire debug interface data input / output . 80 a8 95 swo serial wire viewer output . 81 b8 96 tck jtag test clock input . 78 b9 93 tdi jtag test data input . 79 b11 94 tdo jtag debug data output . 81 b8 96 tms jtag test mode state input / output . 80 a8 95 traceclk trace clk output of etm . 86 c7 101 traced0 trace data output of etm . 82 c8 97 traced1 83 d9 98 traced2 84 a7 99 traced3 85 b7 100 trstx jtag test reset input . 77 a9 92 external bus mad00 e xternal bus interface address bus . 94 c5 114 mad01 93 d6 113 mad02 92 b5 107 mad03 91 a5 106 mad04 90 c6 105 mad05 89 b6 104 mad06 88 a6 103 mad07 87 d7 102 mad08 55 h10 65 mad09 54 j8 64 mad10 45 k8 50 mad11 44 j7 49 mad12 43 h6 48 mad13 42 k7 47 mad14 41 l7 46 mad15 40 j6 45 mad16 39 k6 44 mad17 32 l6 37 mad18 31 h5 36 mad19 30 j5 35 mad20 29 k5 34 mad21 28 l5 33 mad22 27 j4 32 mad23 14 f2 19 mad24 13 f1 18 mcsx0 external bus interface chip select output pin . 57 h7 67 mcsx1 56 h9 66 mcsx2 16 g1 21 mcsx3 15 f3 20 mcsx4 - - 83 mcsx5 - - 82 mcsx6 - - 81 mcsx7 8 d5 8
document number: 002 - 05605 rev. *d page 27 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 external bus mdata0 e xternal bus interface data bus . 2 c1 2 mdata1 3 c2 3 mdata2 4 b3 4 mdata3 5 d1 5 mdata4 6 d2 6 mdata5 7 d3 7 mdata6 9 e1 14 mdata7 10 e2 15 mdata8 63 g8 73 mdata9 64 f10 74 mdata10 65 f9 75 mdata11 66 e11 76 mdata12 67 e10 77 mdata13 68 f8 78 mdata14 69 e9 79 mdata15 70 d11 80 mdqm0 external bus interface byte mask signal output. 11 e3 16 mdqm1 12 e4 17 mnale external bus interface ale signal to control nand flash output pin . - - 9 mncle external bus interface cle signal to control nand flash output pin . - - 10 mnrex external bus interface read enable signal to control nand flash . - - 12 mnwex external bus interface write enable signal to control nand flash . - - 11 moex external bus interface read enable signal for sram. 58 g10 68 mwex external bus interface write enable signal for sram. 59 g9 69
document number: 002 - 05605 rev. *d page 28 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 external interrupt int00_0 external interrupt request 00 input pin . 2 c1 2 int00_1 82 c8 97 int00_2 87 d7 102 int01_0 external interrupt request 01 input pin . 3 c2 3 int01_1 83 d9 98 int01_2 - - 85 int02_0 external interrupt request 02 input pin . 4 b3 4 int02_1 53 j10 63 int02_2 - - 82 int03_0 external interrupt request 03 input pin . 93 d6 113 int03_1 56 h9 66 int03_2 9 e1 14 int04_0 external interrupt request 04 input pin . 12 e4 17 int04_1 59 g9 69 int04_2 10 e2 15 int05_0 external interrupt request 05 input pin . 74 c10 89 int05_1 65 f9 75 int05_2 11 e3 16 int06_1 external interrupt request 06 input pin . 73 c11 88 int06_2 45 k8 50 int07_2 external interrupt request 07 input pin . 5 d1 5 int08_1 external interrupt request 08 input pin . 14 f2 19 int08_2 8 d5 8 int09_1 external interrupt request 09 input pin . 15 f3 20 int09_2 - - 11 int10_1 external interrupt request 10 input pin . 16 g1 21 int10_2 - - 112 int11_1 external interrupt request 11 input pin . 17 g2 22 int11_2 - - 110 int12_1 external interrupt request 12 input pin . 27 j4 32 int12_2 - - 108 int13_1 external interrupt request 13 input pin . 28 l5 33 int13_2 - - 52 int14_1 external interrupt request 14 input pin . 39 k6 44 int14_2 - - 53 int15_1 external interrupt request 15 input pin . 96 c4 116 int15_2 - - 54 nmix non - maskable interrupt input . 92 b5 107
document number: 002 - 05605 rev. *d page 29 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 gpio p00 general - purpose i/o port 0. 77 a9 92 p01 78 b9 93 p02 79 b11 94 p03 80 a8 95 p04 81 b8 96 p05 82 c8 97 p06 83 d9 98 p07 84 a7 99 p08 85 b7 100 p09 86 c7 101 p0a 87 d7 102 p0b 88 a6 103 p0c 89 b6 104 p0d 90 c6 105 p0e 91 a5 106 p0f 92 b5 107 p10 general - purpose i/o port 1. 52 j11 62 p11 53 j10 63 p12 54 j8 64 p13 55 h10 65 p14 56 h9 66 p15 57 h7 67 p16 58 g10 68 p17 59 g9 69 p18 63 g8 73 p19 64 f10 74 p1a 65 f9 75 p1b 66 e11 76 p1c 67 e10 77 p1d 68 f8 78 p1e 69 e9 79 p1f 70 d11 80 p20 general - purpose i/o port 2. 74 c10 89 p21 73 c11 88 p22 72 e8 87 p23 71 d10 86 p24 - - 85 p25 - - 84 p26 - - 83 p27 - - 82 p28 - - 81
document number: 002 - 05605 rev. *d page 30 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 gpio p30 general - purpose i/o port 3. 9 e1 14 p31 10 e2 15 p32 11 e3 16 p33 12 e4 17 p34 13 f1 18 p35 14 f2 19 p36 15 f3 20 p37 16 g1 21 p38 17 g2 22 p39 18 f4 23 p3a 19 g3 24 p3b 20 h1 25 p3c 21 h2 26 p3d 22 g4 27 p3e 23 h3 28 p3f 24 j2 29 p40 general - purpose i/o port 4. 27 j4 32 p41 28 l5 33 p42 29 k5 34 p43 30 j5 35 p44 31 h5 36 p45 32 l6 37 p46 36 l3 41 p47 37 k3 42 p48 39 k6 44 p49 40 j6 45 p4a 41 l7 46 p4b 42 k7 47 p4c 43 h6 48 p4d 44 j7 49 p4e 45 k8 50 p50 general - purpose i/o port 5. 2 c1 2 p51 3 c2 3 p52 4 b3 4 p53 5 d1 5 p54 6 d2 6 p55 7 d3 7 p56 8 d5 8 p57 - - 9 p58 - - 10 p59 - - 11 p5a - - 12 p5b - - 13
document number: 002 - 05605 rev. *d page 31 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 gpio p60 general - purpose i/o port 6. 96 c4 116 p61 95 b4 115 p62 94 c5 114 p63 93 d6 113 p64 - - 112 p65 - - 111 p66 - - 110 p67 - - 109 p68 - - 108 p70 general - purpose i/o port 7. - - 51 p71 - - 52 p72 - - 53 p73 - - 54 p74 - - 55 p80 general - purpose i/o port 8. 98 a3 118 p81 99 a2 119 multi function serial 0 sin0_0 multifunction serial interface ch.0 input pin . 73 c11 88 sin0_1 56 h9 66 sot0_0 (sda0_0) multifunction serial interface ch.0 output pin . this pin operates as so t0 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda0 when it is used in an i 2 c (operation mode 4). 72 e8 87 sot0_1 (sda0_1) 57 h7 67 sck0_0 (scl0_0) multifunction serial interface ch.0 clock i/o pin . this pin operates as sck0 when it is used in a uart/csio (operation modes 0 to 2) and as scl0 when it is used in an i 2 c (operation mode 4). 71 d10 86 sck0_1 (scl0_1) 58 g10 68 multi function serial 1 sin1_0 multifunction serial interface ch.1 input pin . - - 8 sin1_1 53 j10 63 sot1_0 (sda1_0) multifunction serial interface ch.1 output pin . this pin operates as so t1 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda1 when it is used in an i 2 c (operation mode 4). - - 9 sot1_1 (sda1_1) 54 j8 64 sck1_0 (scl1_0) multifunction serial interface ch. 1 clock i/o pin . this pin operates as sck 1 when it is used in a uart/csio (operation modes 0 to 2) and as scl 1 when it is used in an i 2 c (operation mode 4). - - 10 sck1_1 (scl1_1) 55 h10 65
document number: 002 - 05605 rev. *d page 32 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 multi function serial 2 sin2_0 multifunction serial interface ch.2 input pin . - - 53 sin2_1 - - 85 sin2_2 59 g9 69 sot2_0 (sda2_0) multifunction serial interface ch.2 output pin . this pin operates as so t2 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda2 when it is used in an i 2 c (operation mode 4). - - 54 sot2_1 (sda2_1) - - 84 sot2_2 (sda2_2) 63 g8 73 sck2_0 (scl2_0) multifunction serial interface ch.2 clock i/o pin . this pin operates as sck2 when it is used in a uart/csio (operation modes 0 to 2) and as scl2 when it is used in an i 2 c (operation mode 4). - - 55 sck2_1 (scl2_1) - - 83 sck2_2 (scl2_2) 64 f10 74 multi function serial 3 sin3_0 multifunction serial interface ch.3 input pin . - - 110 sin3_1 2 c1 2 sin3_2 39 k6 44 sot3_0 (sda3_0) multifunction serial interface ch.3 output pin . this pin operates as so t3 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda3 when it is used in an i 2 c (operation mode 4). - - 109 sot3_1 (sda3_1) 3 c2 3 sot3_2 (sda3_2) 40 j6 45 sck3_0 (scl3_0) multifunction serial interface ch.3 clock i/o pin . this pin operates as sck3 when it is used in a uart/csio (operation modes 0 to 2) and as scl3 when it is used in an i 2 c (operation mode 4). - - 108 sck3_1 (scl3_1) 4 b3 4 sck3_2 (scl3_2) 41 l7 46
document number: 002 - 05605 rev. *d page 33 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 multi function serial 4 sin4_0 multifunction serial interface ch.4 input pin . 87 d7 102 sin4_1 65 f9 75 sin4_2 82 c8 97 sot4_0 (sda4_0) multifunction serial interface ch.4 output pin . this pin operates as so t4 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda4 when it is used in an i 2 c (operation mode 4). 88 a6 103 sot4_1 (sda4_1) 66 e11 76 sot4_2 (sda4_2) 83 d9 98 sck4_0 (scl4_0) multifunction serial interface ch.4 clock i/o pin . this pin operates as sck4 when it is used in a uart/csio (operation modes 0 to 2) and as scl4 when it is used in an i 2 c (operation mode 4). 89 b6 104 sck4_1 (scl4_1) 67 e10 77 sck4_2 (scl4_2) 84 a7 99 rts4_0 multifunction serial interface ch.4 rts output pin . 90 c6 105 rts4_1 69 e9 79 rts4_2 86 c7 101 cts4_0 multifunction serial interface ch.4 cts input pin . 91 a5 106 cts4_1 68 f8 78 cts4_2 85 b7 100 multi function serial 5 sin5_0 multifunction serial interface ch.5 input pin . 96 c4 116 sin5_1 - - 113 sin5_2 15 f3 20 sot5_0 (sda5_0) multifunction serial interface ch.5 output pin . this pin operates as so t5 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda5 when it is used in an i 2 c (operation mode 4). 95 b4 115 sot5_1 (sda5_1) - - 112 sot5_2 (sda5_2) 16 g1 21 sck5_0 (scl5_0) multifunction serial interface ch.5 clock i/o pin . this pin operates as sck5 when it is used in a uart/csio (operation modes 0 to 2) and as scl5 when it is used in an i 2 c (operation mode 4). 94 c5 114 sck5_1 (scl5_1) - - 111 sck5_2 (scl5_2) 17 g2 22
document number: 002 - 05605 rev. *d page 34 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 multi function serial 6 sin6_0 multifunction serial interface ch.6 input pin . 5 d1 5 sin6_1 12 e4 17 sot6_0 (sda6_0) multifunction serial interface ch.6 output pin . this pin operates as so t6 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda6 when it is used in an i 2 c (operation mode 4). 6 d2 6 sot6_1 (sda6_1) 11 e3 16 sck6_0 (scl6_0) multifunction serial interface ch.6 clock i/o pin . this pin operates as sck6 when it is used in a uart/csio (operation modes 0 to 2) and as scl6 when it is used in an i 2 c (operation mode 4). 7 d3 7 sck6_1 (scl6_1) 10 e2 15 multi function serial 7 sin7_0 multifunction serial interface ch.7 input pin . - - 11 sin7_1 45 k8 50 sot7_0 (sda7_0) multifunction serial interface ch.7 output pin . this pin operates as so t7 when it is used in a uart/csio /lin (operation modes 0 to 3 ) and as sda7 when it is used in an i 2 c (operation mode 4). - - 12 sot7_1 (sda7_1) 44 j7 49 sck7_0 (scl7_0) multifunction serial interface ch.7 clock i/o pin . this pin operates as sck7 when it is used in a uart/csio (operation modes 0 to 2) and as scl7 when it is used in an i 2 c (operation mode 4). - - 13 sck7_1 (scl7_1) 43 h6 48
document number: 002 - 05605 rev. *d page 35 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 multi function timer 0 dtti0x_0 input signal controlling wave form generator outputs rto00 to rto05 of multi - function timer 0 . 18 f4 23 dtti0x_1 69 e9 79 frck0_0 16 - bit free - run timer ch.0 external clock input pin . 13 f1 18 frck0_1 70 d11 80 ic00_0 16 - bit input capture ch.0 input pin of multi - function timer 0 . icxx describes chan n el number. 17 g2 22 ic00_1 65 f9 75 ic01_0 16 g1 21 ic01_1 66 e11 76 ic02_0 15 f3 20 ic02_1 67 e10 77 ic03_0 14 f2 19 ic03_1 68 f8 78 rto00_0 (ppg00_0) wave form generator output of multi - function timer 0 . this pin operates as ppg00 when it is used in ppg 0 output modes . 19 g3 24 rto00_1 (ppg00_1) 71 d10 86 rto01_0 (ppg00_0) wave form generator output of multi - function timer 0 . this pin operates as ppg00 when it is used in ppg 0 output modes . 20 h1 25 rto01_1 (ppg00_1) - - 85 rto02_0 (ppg02_0) wave form generator output of multi - function timer 0 . this pin operates as ppg02 when it is used in ppg 0 output modes . 21 h2 26 rto02_1 (ppg02_1) - - 84 rto03_0 (ppg02_0) wave form generator output of multi - function timer 0 . this pin operates as ppg02 when it is used in ppg 0 output modes . 22 g4 27 rto03_1 (ppg02_1) - - 83 rto04_0 (ppg04_0) wave form generator output of multi - function timer 0 . this pin operates as ppg04 when it is used in ppg 0 output modes . 23 h3 28 rto04_1 (ppg04_1) - - 82 rto05_0 (ppg04_0) wave form generator output of multi - function timer 0. this pin operates as ppg04 when it is used in ppg 0 output modes . 24 j2 29 rto05_1 (ppg04_1) - - 81
document number: 002 - 05605 rev. *d page 36 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 multi function timer 1 dtti1x_0 input signal controlling wave form generator outputs rto 10 to rto 15 of multi - function timer 1 . 8 d5 8 dtti1x_1 39 k6 44 frck1_0 16 - bit free - run timer ch.1 external clock input pin . 87 d7 102 frck1_1 44 j7 49 ic10_0 16 - bit input capture ch.0 input pin of multi - function timer 1 . icxx describes cha n nel number. 88 a6 103 ic10_1 40 j6 45 ic11_0 89 b6 104 ic11_1 41 l7 46 ic12_0 90 c6 105 ic12_1 42 k7 47 ic13_0 91 a5 106 ic13_1 43 h6 48 rto10_0 (ppg10_0) wave form generator o utput of multi - function timer 1 . this pin operates as ppg10 when it is used in ppg 1 output modes . 2 c1 2 rto10_1 (ppg10_1) 27 j4 32 rto11_0 (ppg10_0) wave form generator o utput of multi - function timer 1 . this pin operates as ppg10 when it is used in ppg 1 output modes . 3 c2 3 rto11_1 (ppg10_1) 28 l5 33 rto12_0 (ppg12_0) wave form generator o utput of multi - function timer 1 . this pin operates as ppg12 when it is used in ppg 1 output modes . 4 b3 4 rto12_1 (ppg12_1) 29 k5 34 rto13_0 (ppg12_0) wave form generator o utput of multi - function timer 1 . this pin operates as ppg12 when it is used in ppg 1 output modes . 5 d1 5 rto13_1 (ppg12_1) 30 j5 35 rto14_0 (ppg14_0) wave form generator o utput of multi - function timer 1 . this pin operates as ppg14 when it is used in ppg 1 output modes . 6 d2 6 rto14_1 (ppg14_1) 31 h5 36 rto15_0 (ppg14_0) wave form generator output of multi - function timer 1 . this pin operates as ppg14 when it is used in ppg 1 output modes . 7 d3 7 rto15_1 (ppg14_1) 32 l6 37
document number: 002 - 05605 rev. *d page 37 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 quadrature position/ revolution counter 0 ain0_0 q prc ch.0 ain input pin . 9 e1 14 ain0_1 40 j6 45 ain0_2 2 c1 2 bin0_0 q prc ch.0 bin input pin . 10 e2 15 bin0_1 41 l7 46 bin0_2 3 c2 3 zin0_0 q prc ch.0 zin input pin . 11 e3 16 zin0_1 42 k7 47 zin0_2 4 b3 4 quadrature position/ revolution counter 1 ain1_1 q prc ch.1 ain input pin . 74 c10 89 ain1_2 43 h6 48 bin1_1 q prc ch.1 bin input pin . 73 c11 88 bin1_2 44 j7 49 zin1_1 q prc ch.1 zin input pin . 72 e8 87 zin1_2 45 k8 50
document number: 002 - 05605 rev. *d page 38 of 109 mb9b100a series module pin name function pin no. lqfp - 100 bga - 1 12 lqfp - 120 r eset initx external reset input . a reset is valid when initx=l. 38 k4 43 mode md0 mode 0 pin. during normal operation, md0=l must be input. during serial programming to flash memory, md0=h must be input. 47 l8 57 md1 mode 1 pin. input must always be at the "l" level. 46 k9 56 p ower vcc power pin . 1 b1 1 vcc 26 j1 31 vcc 35 k1 40 vcc 51 k11 61 vcc 76 a10 91 vcc 97 a4 117 gnd vss gnd pin . - b2 - vss 25 l1 30 vss - k2 - vss - j3 - vss - h4 - vss 34 l4 39 vss 50 l11 60 vss - k10 - vss - j9 - vss - h8 - vss - b10 - vss - c9 - vss 75 a11 90 vss - d8 - vss - d4 - vss - c3 - vss 100 a1 120 c lock x0 main clock (oscillation) input pin . 48 l9 58 x0a sub clock (oscillation) input pin . 36 l3 41 x1 main clock (oscillation) i/o pin . 49 l10 59 x1a sub clock (oscillation) i/o pin . 37 k3 42 crout built - in high - speed cr - osc clock output port . 74 c10 89 analog p ower avcc a/d converter analog power pin . 60 h11 70 avrh a/d converter analog reference voltage input pin . 61 f11 71 analog gnd avss a/d converter gnd pin . 62 g11 72 c - pin c power stabilization capacity pin . 33 l2 38 note: ? while this device contains a test access port (tap) based on the ieee 1149.1 - 2001 jtag standard, it is not fully compliant to all requirements of that standard. this device may contain a 32 - bit device id that is the same as the 32 - bit device id in other devices with different functionality. the tap pins may also be configur able for purposes other than access to the tap controller.
document number: 002 - 05605 rev. *d page 39 of 109 mb9b100a series 5. i/o circuit type type circuit remarks a ? oscillation feedback resistor : approximately 1 m ? with standby mode control b ? cmos level hysteresis input ? pull - up resistor : approximately 50 k c ? cmos level hysteresis input clock input x0 x1 standby mode control pull - up resistor digital input mode input
document number: 002 - 05605 rev. *d page 40 of 109 mb9b100a series type circuit remarks d ? it is possible to select the sub oscillation / gpio function when the sub oscillation is selected. ? oscillation feedback resistor : approximately 20 m ? with standby mode control when the gpio is selected. ? cmos level output. ? cmos level hysteresis input ? with pull - up resistor control ? with standby mode control ? pull - up resistor : approximately 50 k ? i oh = - 4 ma, i ol = 4 ma p - ch p - ch n - ch r r p - ch p - ch n - ch x0 a x1 a pull - up resistor feedback resistor pull - up resistor digital output digital output pull - up resistor control digital input standby mode control clock input standby mode control digital input standby mode control digital output digital output pull - up resistor control
document number: 002 - 05605 rev. *d page 41 of 109 mb9b100a series type circuit remarks e ? cmos level output ? cmos level hysteresis input ? with pull - up resistor control ? with standby mode control ? pull - up resistor : approximately 50 k ? i oh = - 4 ma, i ol = 4 ma ? when this pin is used as an i 2 c pin, the digital output p - ch transistor is always off ? +b input is available f ? cmos level output ? cmos level hysteresis input ? with input control ? analog input ? with pull - up resistor control ? with standby mode control ? pull - up resistor : approximately 50 k ? i oh = - 4 ma, i ol = 4 ma ? when this pin is used as an i 2 c pin, the digital output p - ch transistor is always off ? +b input is available digital output digital output pull - up resistor control digital input standby mode c ontrol digital output digital output pull - up resistor control digital input standby mode c ontrol analog input input control p-ch p-ch n-ch r p-ch p-ch n-ch r
document number: 002 - 05605 rev. *d page 42 of 109 mb9b100a series type circuit remarks g ? cmos level output ? cmos level hysteresis input ? with pull - up resistor control ? with standby mode control ? pull - up resistor : approximately 50 k ? i oh = - 12 ma, i ol = 12 ma ? +b input is available h ? cmos level output ? cmos level hysteresis input ? with standby mode control ? i oh = - 25.3 ma, i ol = 19.7 ma digital output digital output pull - up resistor control digital input standby mode c ontrol digital output digital output digital input standby mode control p-ch p-ch n-ch r p-ch n-ch r
document number: 002 - 05605 rev. *d page 43 of 109 mb9b100a series 6. handling precautions any semiconductor devices have inherently a certain rate of failure. the possibility of failure is greatly affected by the co nditions in which they are used (circuit conditions, environmental conditions, etc.). this page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your cypress semiconductor devices. 6.1 precautions for product design this section describes precautions when designing electronic equipment using semiconductor devices. absolute maximum ratings semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of certain established limits, called absolute maximum ratings. do not exceed these ratings. recommended oper ating conditions recommended operating conditions are normal operating ranges for the semiconductor device. all the device's electrical characteristics are warranted when operated within these ranges. always use semiconductor devices within the recommended operating conditions. operation outside these ranges may adversely affect reliability and could result in device failure. no warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. users considering application outside the listed conditions are advised to contact their sales representative beforehand. processing and protection of pins these precautions must be followed when handling the pins which connect semiconductor devices to power supply and inpu t/output functions. 1. preventing over - voltage and over - current conditions exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the dev ice, and in extreme cases leads to permanent damage of the device. try to prevent such overvoltage or over - current conditions at the design stage. 2. protection of output pins shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows . such conditions if present for extended periods of time can damage the device. therefore, avoid this type of connection. 3. handling of unused input pins unconnected input pins with very high impedance levels can adversely affect stability of operation. such pins should be connected through an appropriate resistance to a power supply pin or ground pin. latch - up semiconductor devices are constructed by the formation of p - type and n - type areas on a substrate. when subjected to abnormally high voltages, internal parasitic pnpn junctions (called thyristor structures) may be formed, causing large current levels in excess of several hundred ma to flow continuously at the power supply pin. this condition is called latch - up. caution: the occurrence of latch - up not only causes loss of reliability in the semiconductor device, but can cause injury or damage from high heat, smoke or flame. to prevent this from happening, do the following: 1. be sure that voltages applied to pins do not exceed the absolute maximum ratings. this should include attention to abnormal noise, surge levels, etc. 2. be sure that abnormal current flows do not occur during the power - on sequence. observance of safety regulations and standards most countries in the world have established standards and regulations regarding safety, protection from electromagnetic interference, etc. customers are requested to observe applicable regulations and standards in the design of products. fail - safe design any semiconductor devices have inherently a certain rate of failure. you must pro tect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over - current levels and other abnormal operating conditions.
document number: 002 - 05605 rev. *d page 44 of 109 mb9b100a series precaution s related to usage of devices cypress semiconductor devices are intended for use in standard applications (computers, office automation and other office equipment, industrial, communications, and measurement equipment, personal or household devices, etc.). caution: customers considering the use of our products in special applications where failure or abnormal operation may direct ly affect human lives or cause physical injury or property damage, or where extremely high levels of reliability are demanded (s uc h as aerospace systems, atomic energy controls, sea floor repeaters, vehicle operating controls, medical devices for life support, etc.) are requested to consult with sales representatives before such use. the company will not be responsible for damages ar ising from such use without prior approval. 6.2 precautions for package mounting package mounting may be either lead insertion type or surface mount type. in either case, for heat resistance during solderin g, you should only mount under cypress ' recommended c onditions. for detailed information about mount conditions, contact your sales representative. lead insertion type mounting of lead insertion type packages onto printed circuit boards may be done by two methods: direct soldering on the boar d, or mounting b y using a socket. direct mounting onto boards normally involves processes for inserting leads into through - holes on the board and using the flow soldering (wave soldering) method of applying liquid solder. in this case, the soldering process usually causes leads to be subjected to thermal stress in excess of the absolute ratings for storage temperature. mounting processes should conform to cypress recommended mounting conditions. if socket mounting is used, differences in surface treatment of the socket con tacts and ic lead surfaces can lead to contact deterioration after long periods. for this reason it is recommended that the surface treatment of socket contacts and ic lead s be verified before mounting. surface mount type surface mount packaging has longer and thinner leads than lead - insertion packaging, and therefore leads are more easily deformed or bent. the use of packages with higher pin counts and narrower pin pitch results in increased susceptibility to op en connections caused by deformed pins, or sh orting due to solder bridges. you must use appropriate mounting techniques. cypress recommends the solder reflow method, and has established a ranking of mounting conditions for each product. users are advised to mount packages in accordance with cypress r anking of recommended conditions. lead - free packaging caution: when ball grid array (bga) packages with sn - ag - cu balls are mounted using sn - pb eutectic soldering, junction strength may be reduced under some conditions of use. storage of semiconductor devic es because plastic chip packages are formed from plastic resins, exposure to natural environmental conditions will cause absorpt ion of moisture. during mounting, the application of heat to a package that has absorbed moisture can cause surfaces to peel, re ducing moisture resistance and causing packages to crack. to prevent, do the following: 1. avoid exposure to rapid temperature changes, which cause moisture to condense inside the product. store products in locations where temperature changes are slight. 2. use dry boxes for product storage. products should be stored below 70% relative humidity, and at temperatures between 5 c and 30 c . when you open dry package that recommends humidity 40% to 70% relative humidity. 3. when necessary, cypress packages semiconductor devices in highly moisture - resistant aluminum laminate bags, with a silica gel desiccant. devices should be sealed in their aluminum laminate bags for storage. 4. avoid storing packages where they are exposed to corrosive gases or high levels of dust. baking packages that have absorbed moisture may be de - moisturized by baking (heat drying). follow the cypress recommended conditions for baking. condition: 125 c /24 h
document number: 002 - 05605 rev. *d page 45 of 109 mb9b100a series static electricity because semiconductor devices are particularly susceptible to damage by static electricity, you must take the following precautions: 1. maintain relative humidity in the working environment between 40% and 70%. use of an apparatus for ion generation may be needed to remove electricity. 2. electrically ground all conveyors, solder ve ssels, soldering irons and peripheral equipment. 3. eliminate static body electricity by the use of rings or bracelets connected to ground through high resistance (on the level of 1 m ). wearing of conductive clothing and shoes, use of conductive floor mats and other measures to minimize shock loads is recommended. 4. ground all fixtures and instruments, or protect with anti - static measures. 5. avoid the use of styrofoam or other highly static - prone materials for storage of completed board assemblies. 6.3 precautions for use environment reliability of semiconductor devices depends on ambient temperature and other conditions as described above. for reliable performance, do the following: 1. humidity prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. if high humidity levels are anticipated, consider anti - humidity processing. 2. discharge of static electricity when high - voltage charges exist close to semiconductor devices, discharges can cause abnormal operation. in such cases, use anti - static measures or processing to prevent discharges. 3. corrosive gases, dust, or oil exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely affect the device. if you use devices in such conditions, con sider ways to prevent such exposure or to protect the devices. 4. radiation, including cosmic radiation most devices are not designed for environments involving exposure to radiation or cosmic radiation. users should provide shielding as appropriate. 5. smoke, f lame caution: plastic molded devices are flammable, and therefore should not be used near combustible substances. if devices begin to smoke or burn, there is danger of the release of toxic gases. customers considering the use of cypress products in other special environmental conditions should consult with sales representatives.
document number: 002 - 05605 rev. *d page 46 of 109 mb9b100a series 7. handling devices power supply pins in products with multiple v cc and v ss pins, respective pins at the same potential are interconnected within the device in order to prevent malf unctions such as latch - up. however, all of these pins should be connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the ground le vel, and to conform to the total output current rating. moreover, connect the current supply source with each power supply pin and gnd pin of this device at low impedance. it is also advisable that a ceramic capacitor of approximately 0.1 f be connected a s a bypass capacitor between each power supply pin and gnd pin , between avcc pin and avss pin near this device. stabilizing power supply voltage a malfunction may occur when the power supply voltage fluctuates rapidly even though the fluctuation is within the recommended operating conditions of the vcc power supply voltage. as a rule, with voltage stabilization, suppress the voltage fluctuation so that the fluctuation in vcc ripple (peak - to - peak value) at the commercial frequency (50 hz/60 hz) does not exce ed 10% of the vcc value in the recommended operating conditions, and the transient fluctuation rate does not exceed 0.1 v/ s when there is a momentary fluctuation on switching the power supply. crystal oscillator circuit noise near the x0 /x1 and x0a/ x1 a pi ns may cause the device to malfunction. design the printed circuit board so that x0 / x1, x0a/x1a pins, the crystal oscillator (or ceramic oscillator), and the bypass capacitor to ground are located as close to the device as possible. it is strongly recommen ded that the pc board artwork be designed such that the x0 /x1 and x0a/ x1 a pins are surrounded by ground plane as this is expected to produce stable operation. evaluate oscillation of your using crystal oscillator by your mount board. using an external clock when using an external clock, the clock signal should be input to the x0 ,x0a pin only and the x1 ,x1a pin should be kept open. handling when using multi function serial pin a s i 2 c pin if it is using multi function serial pin as i 2 c pins, p - ch transistor of digital output is always disable. however, i 2 c pins need to keep the electrical characteristic like other pins and not to connect to external i 2 c bus system with power off. ? example of using an external clock device x0 (x0a) x1 (x1a) open
document number: 002 - 05605 rev. *d page 47 of 109 mb9b100a series c pin this series contains the regulator. be sure to connect a smoothing capacitor (c s ) for the regulator between the c pin and the gnd pin. please use a ceramic capacitor or a capacitor of equivalent frequency characteristics as a smoothing capacitor. however, some laminated ceramic capacitors have the characteristics of capacitance variation due to thermal fluctuation (f characteristics and y5v characteristics). please select the capacitor that meets the specifications in the operating conditio ns to us e by evaluating the temperature characteristics of a capacitor. a smoothing capacitor of about 4.7 f would be recommended for this series. mode pins (md0, md1) connect the md pin (md0, md1) directly to v cc or v ss pins. des ign the printed circuit board such that the pull - up/down resistance stays low, as well as the distance between the mode pins and v cc pins or v ss pins is as short as possible and the connection impedance is low, when the pins are pulled - up/down such as for switching the pin level and rewriting the flash memory data. it is because of preventing the device erroneously switching to test mode due to noise. notes on power - on turn power on/off in the following order or at the same time. if not using the a/d conve rter, connect avcc =vcc and avss = vss. t urning on : vcc ? av cc ? avrh t urning off : avrh ? av cc ? vcc serial communication there is a possibility to receive wrong data due to the noise or other causes on the serial communication. therefore, design a printed circuit board so as to avoid noise. consider the case of receiving wrong data due to noise, perform error detection such as by applying a checksum of data at the end. if an error is detected , restransmit the data. differences in features among the products with different memory sizes and between flash products and mask products the electric characteristics including power consumption, esd, latch - up, noise characteristics, and oscillation characteristics among the products with different memory size s and between flash products and mask products are different because chip layout and memory structures are different. if you are switching to use a different product of the same series, please make sure to evaluate the electric characteristics . device c vss c s gnd
document number: 002 - 05605 rev. *d page 48 of 109 mb9b100a series 8. block di agram 9. memory size see " memory size " in " product lineup " to confirm the memory size. a h b - a p b b r i d g e : a p b 2 ( m a x . 4 0 m h z ) a h b - a p b b r i d g e : a p b 1 ( m a x . 4 0 m h z ) a h b - a h b b r i d g e a h b - a p b b r i d g e : a p b 0 ( m a x . 4 0 m h z ) m u l t i - l a y e r a h b ( m a x . 8 0 m h z ) f l a s h i / f c o r t e x - m 3 c l o c k r e s e t g e n e r a t o r d u a l - t i m e r w a t c h d o g t i m e r ( h a r d w a r e ) d m a c 8 c h . o n - c h i p f l a s h 1 2 8 / 2 5 6 / 3 8 4 / 5 1 2 k b y t e m u l t i f u n c t i o n t i m e r x 2 m u l t i - f u n c t i o n s e r i a l i / f 8 c h . ( w i t h f i f o c h . 4 7 ) * h w f l o w c o n t r o l ( c h . 4 ) 1 6 - b i t f r e e r u n t i m e r 3 c h . 1 6 - b i t o u t p u t c o m p a r e 6 c h . 1 6 - b i t i n p u t c a p t u r e 4 c h . w a v e f o r m g e n e r a t o r 3 c h . a / d a c t i v a t i o n c o m p a r e 3 c h . 1 6 - b i t p p g 3 c h . w a t c h c o u n t e r u n i t 0 g p i o c s v l v d e x t e r n a l i n t e r r u p t c o n t r o l l e r 1 6 - p i n + n m i p o w e r o n r e s e t t p i u r o m t a b l e e t m s r a m 0 8 / 1 6 / 2 4 / 3 2 k b y t e s w j - d p s r a m 1 8 / 1 6 / 2 4 / 3 2 k b y t e i d s y s m b 9 b f 1 0 2 a / 1 0 4 a / 1 0 5 a / 1 0 6 a b a s e t i m e r 1 6 - b i t 8 c h . / 3 2 - b i t 4 c h . m p u n v i c w a t c h d o g t i m e r ( s o f t w a r e ) s e c u r i t y 1 2 - b i t a / d c o n v e r t e r u n i t 1 u n i t 2 t r s t x , t c k t d i , t m s t r a c e d [ 3 : 0 ] , t r a c e c l k x 0 a v c c , a v s s , a v r h a n [ 1 5 : 0 ] t i o a [ 7 : 0 ] t i o b [ 7 : 0 ] i c 0 [ 3 : 0 ] d t t i [ 1 : 0 ] x r t o 0 [ 5 : 0 ] f r c k [ 1 : 0 ] c t d o x 1 x 0 a x 1 a s c k [ 7 : 0 ] s i n [ 7 : 0 ] s o t [ 7 : 0 ] i n t [ 1 5 : 0 ] n m i x p 0 [ f : 0 ] , p 1 [ f : 0 ] , ? ? p x [ x : 0 ] , i n i t x m o d e - c t r l i r q - m o n i t o r p i n - f u n c t i o n - c t r l m d [ 1 : 0 ] r e g u l a t o r q p r c 2 c h . a i n [ 1 : 0 ] b i n [ 1 : 0 ] z i n [ 1 : 0 ] l v d c t r l c r c a c c e l e r a t o r i c 1 [ 3 : 0 ] a d t g [ 8 : 0 ] r t s 4 c t s 4 e x t e r n a l b u s i f m a d [ 2 4 : 0 ] m d a t a [ 1 5 : 0 ] m c s x [ 7 : 0 ] , m o e x , m w e x , m n a l e , m n c l e m n w e x , m n r e x , m d q m [ 1 : 0 ] r t o 1 [ 5 : 0 ] p l l c l k c r 1 0 0 k h z s o u r c e c l o c k c r o u t m a i n o s c s u b o s c c r 4 m h z
document number: 002 - 05605 rev. *d page 49 of 109 mb9b100a series 10. memory map memory map ( 1) f l a s h 0 x 0 0 0 0 _ 0 0 0 0 0 x 0 0 1 0 _ 0 0 0 0 0 x 2 0 0 0 _ 0 0 0 0 0 x 1 f f 8 _ 0 0 0 0 s r a m 0 s r a m 1 0 x 2 0 0 8 _ 0 0 0 0 r e s e r v e d 0 x 2 2 0 0 _ 0 0 0 0 r e s e r v e d 3 2 m b y t e b i t b a n d a l i a s 0 x 2 4 0 0 _ 0 0 0 0 r e s e r v e d 0 x 4 0 0 0 _ 0 0 0 0 p e r i p h e r a l s 0 x 4 2 0 0 _ 0 0 0 0 0 x 6 0 0 0 _ 0 0 0 0 0 x e 0 0 0 _ 0 0 0 0 c o r t e x - m 3 p r i v a t e p e r i p h e r a l s 0 x e 0 1 0 _ 0 0 0 0 r e s e r v e d 0 x f f f f _ f f f f 3 2 m b y t e b i t b a n d a l i a s r e s e r v e d 0 x 4 4 0 0 _ 0 0 0 0 0 x 4 0 0 0 _ 0 0 0 0 0 x 4 1 f f _ f f f f f l a s h i / f 0 x 4 0 0 0 _ 1 0 0 0 r e s e r v e d 0 x 4 0 0 1 _ 0 0 0 0 c l o c k / r e s e t 0 x 4 0 0 1 _ 2 0 0 0 0 x 4 0 0 1 _ 1 0 0 0 s w w d t h w w d t 0 x 4 0 0 1 _ 5 0 0 0 r e s e r v e d 0 x 4 0 0 1 _ 3 0 0 0 d u a l t i m e r 0 x 4 0 0 1 _ 6 0 0 0 r e s e r v e d 0 x 4 0 0 2 _ 0 0 0 0 p e r i p h e r a l s a r e a m f t u n i t 0 0 x 4 0 0 2 _ 1 0 0 0 m f t u n i t 1 0 x 4 0 0 2 _ 2 0 0 0 r e s e r v e d p p g 0 x 4 0 0 2 _ 4 0 0 0 0 x 4 0 0 2 _ 5 0 0 0 b a s e t i m e r 0 x 4 0 0 2 _ 6 0 0 0 q p r c 0 x 4 0 0 2 _ 7 0 0 0 a / d c 0 x 4 0 0 2 _ 8 0 0 0 r e s e r v e d 0 x 4 0 0 3 _ 0 0 0 0 e x t i 0 x 4 0 0 3 _ 1 0 0 0 i n t - r e q . r e a d 0 x 4 0 0 3 _ 2 0 0 0 0 x 4 0 0 3 _ 3 0 0 0 0 x 4 0 0 3 _ 4 0 0 0 0 x 4 0 0 3 _ 5 0 0 0 0 x 4 0 0 3 _ 6 0 0 0 0 x 4 0 0 3 _ 7 0 0 0 r e s e r v e d g p i o l v d r e s e r v e d r e s e r v e d 0 x 4 0 0 3 _ 8 0 0 0 m f s 0 x 4 0 0 3 _ 9 0 0 0 c r c 0 x 4 0 0 3 _ a 0 0 0 w a t c h c o u n t e r 0 x 4 0 0 3 _ b 0 0 0 r e s e r v e d 0 x 4 0 0 4 _ 0 0 0 0 e x t - b u s i / f r e s e r v e d 0 x 4 0 0 5 _ 0 0 0 0 0 x 4 0 0 6 _ 0 0 0 0 r e s e r v e d 0 x 4 0 0 6 _ 1 0 0 0 r e s e r v e d 0 x 4 0 0 6 _ 2 0 0 0 d m a c 0 x 4 0 0 6 _ 3 0 0 0 r e s e r v e d 0 x 4 0 0 3 _ f 0 0 0 r e s e r v e d r e s e r v e d 0 x 4 0 0 2 _ e 0 0 0 c r t r i m 0 x 4 0 0 2 _ f 0 0 0 r e s e r v e d 0 x 4 0 0 6 _ 4 0 0 0 r e s e r v e d s e c u r i t y / c r t r i m 0 x 0 0 1 0 _ 2 0 0 0 p l e a s e r e f e r t o t h e n e x t p a g e f o r t h e m e m o r y s i z e d e t a i l s . e x t e r n a l d e v i c e a r e a 0 x 7 0 0 0 _ 0 0 0 0 r e s e r v e d
document number: 002 - 05605 rev. *d page 50 of 109 mb9b100a series memory map ( 2) *: see " mb9b500/400/300/100/mb9a100 series flash programming m anual " for sector s tructure of flash. s a 1 0 - 1 1 ( 6 4 k b x 2 ) s a 8 - 9 ( 4 8 k b x 2 ) s a 4 - 7 ( 8 k b x 4 ) s a 1 0 - 1 3 ( 6 4 k b x 4 ) s a 8 - 9 ( 4 8 k b x 2 ) s a 4 - 7 ( 8 k b x 4 ) s a 1 0 - 1 5 ( 6 4 k b x 6 ) s a 8 - 9 ( 4 8 k b x 2 ) s a 4 - 7 ( 8 k b x 4 ) 0 x 0 0 0 0 _ 0 0 0 0 0 x 2 0 0 0 _ 0 0 0 0 0 x 1 f f f _ 8 0 0 0 s r a m 0 3 2 k b y t e s r a m 1 3 2 k b y t e 0 x 2 0 0 8 _ 0 0 0 0 r e s e r v e d s e c u r i t y 0 x 0 0 1 0 _ 0 0 0 0 0 x 0 0 0 8 _ 0 0 0 0 r e s e r v e d 0 x 2 0 0 0 _ 8 0 0 0 c r t r i m m i n g 0 x 0 0 1 0 _ 1 0 0 0 0 x 0 0 1 0 _ 2 0 0 0 r e s e r v e d s r a m 1 1 6 k b y t e s r a m 0 1 6 k b y t e 0 x 0 0 0 0 _ 0 0 0 0 0 x 0 0 0 0 _ 0 0 0 0 0 x 1 f f f _ a 0 0 0 r e s e r v e d s e c u r i t y 0 x 0 0 1 0 _ 0 0 0 0 0 x 0 0 0 6 _ 0 0 0 0 c r t r i m m i n g 0 x 0 0 1 0 _ 1 0 0 0 0 x 0 0 1 0 _ 2 0 0 0 r e s e r v e d 0 x 1 f f f _ c 0 0 0 r e s e r v e d s e c u r i t y 0 x 0 0 1 0 _ 0 0 0 0 0 x 0 0 0 4 _ 0 0 0 0 c r t r i m m i n g r e s e r v e d 0 x 2 0 0 8 _ 0 0 0 0 r e s e r v e d 0 x 2 0 0 0 _ 4 0 0 0 0 x 2 0 0 0 _ 0 0 0 0 0 x 0 0 1 0 _ 1 0 0 0 0 x 0 0 1 0 _ 2 0 0 0 s r a m 1 2 4 k b y t e s r a m 0 2 4 k b y t e 0 x 2 0 0 0 _ 6 0 0 0 0 x 2 0 0 0 _ 0 0 0 0 0 x 2 0 0 8 _ 0 0 0 0 r e s e r v e d m b 9 b f 1 0 6 n a / r a m b 9 b f 1 0 5 n a / r a m b 9 b f 1 0 4 n a / r a f l a s h 5 1 2 k b y t e f l a s h 3 8 4 k b y t e f l a s h 2 5 6 k b y t e s a 8 - 9 ( 4 8 k b x 2 ) s a 4 - 7 ( 8 k b x 4 ) s r a m 1 8 k b y t e s r a m 0 8 k b y t e 0 x 0 0 0 0 _ 0 0 0 0 0 x 1 f f f _ c 0 0 0 r e s e r v e d s e c u r i t y 0 x 0 0 1 0 _ 0 0 0 0 0 x 0 0 0 2 _ 0 0 0 0 c r t r i m m i n g r e s e r v e d 0 x 2 0 0 8 _ 0 0 0 0 r e s e r v e d 0 x 2 0 0 0 _ 4 0 0 0 0 x 2 0 0 0 _ 0 0 0 0 0 x 0 0 1 0 _ 1 0 0 0 0 x 0 0 1 0 _ 2 0 0 0 m b 9 b f 1 0 2 n a / r a f l a s h 1 2 8 k b y t e
document number: 002 - 05605 rev. *d page 51 of 109 mb9b100a series peripheral address map start address end address bus peripherals 0x4000_0000 0x4000_0fff ahb flash memory i/f register 0x4000_1000 0x4000_ffff reserved 0x4001_0000 0x4001_0fff apb0 clock/reset control 0x4001_1000 0x4001_1fff hardware watchdog timer 0x4001_2000 0x4001_2fff software watchdog timer 0x4001_3000 0x4001_4fff reserved 0x4001_5000 0x4001_5fff dual - timer 0x4001_6000 0x4001_ffff reserved 0x4002_0000 0x4002_0fff apb1 multi - function timer unit 0 0x4002_1000 0x4002_1fff multi - function timer unit 1 0x4002_2000 0x4002_3fff reserved 0x4002_4000 0x4002_4fff ppg 0x4002_5000 0x4002_5fff base timer 0x4002_6000 0x4002_6fff quadrature position/revolution counter 0x4002_7000 0x4002_7fff a/d converter 0x4002_8000 0x4002_dfff reserved 0x4002_e000 0x4002_efff inter nal cr trimming 0x4002_f000 0x4002_ffff reserved 0x4003_0000 0x4003_0fff apb2 external interrupt controller 0x4003_1000 0x4003_1fff interrupt request batch - read function 0x4003_2000 0x4003_2fff reserved 0x4003_3000 0x4003_3fff gpio 0x4003_4000 0x4003_4fff reserved 0x4003_5000 0x4003_5fff low voltage detector 0x4003_6000 0x4003_6fff reserved 0x4003_7000 0x4003_7fff reserved 0x4003_8000 0x4003_8fff multi - function serial interface 0x4003_9000 0x4003_9fff crc 0x4003_a000 0x4003_afff watch counter 0x4003_b000 0x4003_efff reserved 0x4003_f000 0x4003_ffff external memory interface 0x4004_0000 0x4004_ffff ahb reserved 0x4005_0000 0x4005_ffff reserved 0x4006_0000 0x4006_0fff dmac register 0x4006_1000 0x4006_1fff reserved 0x4006_2000 0x4006_2fff reserved 0x4006_3000 0x4006_3fff reserved 0x4006_4000 0x41ff_ffff reserved
document number: 002 - 05605 rev. *d page 52 of 109 mb9b100a series 11. pin status in each cpu state the terms used for pin status have the following meanings. ? initx=0 this is the period when the initx pin is the " l " level. ? initx=1 this is the period when the initx pin is the " h " level. ? spl = 0 this is the status that standby pin level setting bit (spl) in standby mo de control register (stb_ctl) is set to " 0 " . ? spl = 1 this is the status that standby pin level setting bit (spl) in standby mode control register (stb_ctl) is set to " 1 " . ? input enabled indicates that the input function can be used. ? internal input fixed at " 0 " this is the status that the input function cannot be used. internal input is fixed at " l " . ? hi - z indicates that the output drive transistor is disabled and the pin is put in the hi - z state. ? setting disabled indicates that the setting is disabled. ? maintain previous state maintains the state that was immediately prior to entering the current mode. if a built - in peripheral function is operating, the output follows the peripheral function. if the pin is being used as a port, that output is maintained. ? analog i nput is enabled indicates that the analog input is enabled. ? trace output indicates that the trace function can be used.
document number: 002 - 05605 rev. *d page 53 of 109 mb9b100a series list of pin status pin status type function group power - on reset or low voltage detection state initx input state device internal reset state run mode or sleep mode state timer mode or sleep mode state power supply unstable power supply stable power supply stable power supply stable - initx=0 initx=1 initx=1 initx=1 - - - - spl=0 spl=1 a main crystal oscillator input pin input enabled input enabled input enabled input enabled input enabled input enabled b main crystal oscillator output pin h output/ internal input fixed at " 0 " / or input enabled h output/ internal input fixed at " 0 " h output/ internal input fixed at " 0 " maintain previous state/ h output at oscillation stop (*1)/ internal input fixed at " 0 " maintain previous state/ h output at oscillation stop (*1)/ internal input fixed at " 0 " maintain previous state/ h output at oscillation stop (*1)/ internal input fixed at " 0 " c initx input pin pull - up/ input enabled pull - up/ input enabled pull - up/ input enabled pull - up/ input enabled pull - up/ input enabled pull - up/ input enabled d mode input pin input enabled input enabled input enabled input enabled input enabled input enabled e jtag selected hi - z pull - up/ input enabled pull - up/ input enabled maintain previous state maintain previous state maintain previous state gpio selected setting disabled setting disabled setting disabled hi - z/ internal input fixed at " 0 " f trace selected setting disabled setting disabled setting disabled maintain previous state maintain previous state trace output external interrupt enabled selected maintain previous state gpio selected, or other than above resource selected hi - z hi - z/ input enabled hi - z/ input enabled hi - z/ internal input fixed at " 0 "
document number: 002 - 05605 rev. *d page 54 of 109 mb9b100a series pin status type function group power - on reset or low voltage detection state initx input state device internal reset state run mode or sleep mode state timer mode or sleep mode state power supply unstable power supply stable power supply stable power supply stable - initx=0 initx=1 initx=1 initx=1 - - - - spl=0 spl=1 g trace selected setting disabled setting disabled setting disabled maintain previous state maintain previous state trace output gpio selected, or other than above resource selected hi - z hi - z/ input enabled hi - z/ input enabled hi - z/ internal input fixed at " 0 " h external interrupt enabled selected setting disabled setting disabled setting disabled maintain previous state maintain previous state maintain previous state gpio selected, or other than above resource selected hi - z hi - z/ input enabled hi - z/ input enabled hi - z/ internal input fixed at " 0 " i gpio selected, resource selected hi - z hi - z/ input enabled hi - z/ input enabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " j nmix selected setting disabled setting disabled setting disabled maintain previous state maintain previous state maintain previous state gpio selected, or other than above resource selected hi - z hi - z/ input enabled hi - z/ input enabled hi - z/ internal input fixed at " 0 "
document number: 002 - 05605 rev. *d page 55 of 109 mb9b100a series pin status type function group power - on reset or low voltage detection state initx input state device internal reset state run mode or sleep mode state timer mode or sleep mode state power supply unstable power supply stable power supply stable power supply stable - initx=0 initx=1 initx=1 initx=1 - - - - spl=0 spl=1 k analog input selected hi - z hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled gpio selected, or other than above resource selected setting disabled setting disabled setting disabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " l external interrupt enabled selected setting disabled setting disabled setting disabled maintain previous state maintain previous state maintain previous state analog input selected hi - z hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled hi - z/ internal input fixed at " 0 " / analog input enabled gpio selected, or other than above resource selected setting disabled setting disabled setting disabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " m gpio selected setting disabled setting disabled setting disabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " sub crystal oscillator input pin input enabled input enabled input enabled input enabled input enabled input enabled
document number: 002 - 05605 rev. *d page 56 of 109 mb9b100a series pin status type function group power - on reset or low voltage detection state initx input state device internal reset state run mode or sleep mode state timer mode or sleep mode state power supply unstable power supply stable power supply stable power supply stable - initx=0 initx=1 initx=1 initx=1 - - - - spl=0 spl=1 n gpio selected setting disabled setting disabled setting disabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " sub crystal oscillator output pin hi - z/ internal input fixed at " 0 " hi - z/ internal input fixed at " 0 " hi - z/ internal input fixed at " 0 " maintain previous state maintain previous state/ hi - z at oscillation stop (*2)/ internal input fixed at " 0 " maintain previous state/ hi - z at oscillation stop (*2)/ internal input fixed at " 0 " o gpio selected hi - z hi - z/ input enabled hi - z/ input enabled maintain previous state maintain previous state hi - z/ internal input fixed at " 0 " *1 : oscillation is stopped at sub timer mode , low speed cr timer mode, and stop mode. *2 : oscillation is stopped at stop mode.
document number: 002 - 05605 rev. *d page 57 of 109 mb9b100a series 12. electrical characteristics 12.1 absolute maximum ratings parameter symbol rating unit remarks min max power supply voltage* 1, * 2 vcc vss - 0.5 vss + 6.5 v analog power supply voltage* 1, * 3 avcc vss - 0.5 vss + 6.5 v analog reference voltage* 1, * 3 avrh vss - 0.5 vss + 6.5 v input voltage* 1 v i vss - 0.5 vcc + 0.5 ( 6.5 v ) v analog pin input voltage* 1 v ia vss - 0.5 avcc + 0.5 ( 6.5 v ) v output voltage* 1 v o vss - 0.5 vcc + 0.5 ( 6.5 v ) v clamp maximum current i clamp - 2 +2 ma *7 clamp total maximum current [i clamp ] +20 ma *7 " l " level maximum output current* 4 i ol - 10 ma 4ma type 20 ma 12ma type 39 ma p80, p81 " l " level average output current* 5 i olav - 4 ma 4ma type 12 ma 12ma type 19.7 ma p80, p81 " l " level total maximum output current i ol - 100 ma " l " level total average output current* 6 i olav - 50 ma " h " level maximum output current* 4 i oh - - 10 ma 4ma type - 20 ma 12ma type - 39 ma p80, p81 " h " level average output current* 5 i ohav - - 4 ma 4ma type - 12 ma 12ma type - 25.3 ma p80, p81 " h " level total maximum output current i oh - - 100 ma " h " level total average output current* 6 i ohav - - 50 ma power consumption p d - 800 mw storage temperature t stg - 55 + 150 ? c * 1: these parameters are based on the condition that vss = avss = 0.0 v. *2 : v cc must not drop below vss - 0.5 v. *3 : be careful not to exceed v cc + 0. 5 v, for example, when the power is turned on. *4 : the maximum output current is the peak value for a single pin. *5 : the average output is the average current for a single pin over a period of 100 ms. *6 : the total average output current is the average current for all pins over a period of 100 ms.
document number: 002 - 05605 rev. *d page 58 of 109 mb9b100a series *7: ? see " list of pin functions " and " i/o circuit type " about +b input available pin. ? use within recommended operating conditions. ? use at dc voltage (current) the +b input . ? the +b signal should alwa ys be applied a limiting resistance placed between the +b signal and the device. ? the value of the limiting resistance should be set so that when the +b signal is applied the input current to the device pin does not exceed rated values, either instantaneous ly or for prolonged periods. ? note that when the device drive current is low, such as in the low - power consump t ion modes, the +b input potential may pass through the protective diode and increase the potential at the v cc and avcc pin, and this may affect other devices. ? note that if a +b signal is input when the device power supply is off (not fixed at 0 v), the power supply is provided from the pins, so that incomplete operation may result. ? the following is a r ecommended circuit e xample (i/o equivalent circuit ) . warning : ? semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. do not exceed these ratings. r +b input (0v to 16v) protection diode p - ch v cc v cc limiting resistor n - ch av cc analog input digital input digital output
document number: 002 - 05605 rev. *d page 59 of 109 mb9b100a series 12.2 recommended operating conditions (vss = avss = 0.0v) parameter symbol conditions value unit remarks min max power supply voltage vcc - 2.7* 2 5.5 v analog power supply voltage avcc - 2.7 5.5 v avcc = vcc analog reference voltage avrh - 2.7 avcc v smoothing capacitor c s - 1 10 f for built - in regulator* 1 operating temperature lqm 120 lqi 100 lbc 112 t a when mounted on four - layer pcb - 40 + 85 ? c when mounted on double - sided single - layer pcb - 40 + 85 ? c icc ? 100 ma - 40 + 70 ? c icc > 100 ma *1: see "c pin" in "handling devices" for the connection of the smoothing capacitor. *2: in between less than the minimum power supply voltage and low voltage reset/interrupt detection voltage or more, instruction execution and low voltage detection function by built - in high - speed cr(including main pll is used) or built - in low - speed cr is possible to operate on ly. warning : ? the recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. all of the device's electrical characteristics are warranted when the device is operated within these ranges. always use se miconductor devices within their recommended operating condition ranges. operation outside these ranges may adversely affect reliability and could result in device failure. no warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. users considering application outside the listed conditions are advised to contact their representatives beforehand.
document number: 002 - 05605 rev. *d page 60 of 109 mb9b100a series 12.3 dc characteristics 12.3.1 current rating (vcc = avcc =2.7v to 5.5v, vss = avss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks typ* 3 max* 4 run mode current icc vcc pll run mode cpu: 80 mhz, peripheral: 40 mhz, flash 2 wait frwtr.rwt = 10 fsyndn.sd = 000 96 118 ma *1 , *5 cpu: 60 mhz, peripheral: 30 mhz, flash 0 wait frwtr.rwt = 00 fsyndn.sd = 000 76 94 ma *1 , *5 cpu: 80 mhz, peripheral: 40 mhz, flash 5 wait frwtr.rwt = 10 fsyndn.sd = 011 66 82 ma *1 , *5 cpu: 60 mhz, peripheral: 30 mhz, flash 3 wait frwtr.rwt = 00 fsyndn.sd = 011 52 65 ma *1 , *5 high - speed cr run mode cpu/peripheral: 4 mhz* 2 flash 0 wait frwtr.rwt = 00 fsyndn.sd = 000 6.0 9.2 ma *1 sub run mode cpu/peripheral: 32 khz flash 0 wait frwtr.rwt = 00 fsyndn.sd = 000 0.2 2.24 ma *1 , *6 low - speed cr run mode cpu/peripheral: 100 khz flash 0 wait frwtr.rwt = 00 fsyndn.sd = 000 0.3 2.36 ma *1 sleep mode current iccs pll sleep mode peripheral: 40 mhz 43 54 ma *1 , *5 high - speed cr sleep mode peripheral: 4 mhz* 2 3.5 6.2 ma *1 sub sleep mode peripheral: 32 khz 0.15 2.18 ma *1 , *6 low - speed cr sleep mode peripheral: 100 khz 0.22 2.27 ma *1 *1: when a l l ports are fixed. *2: when setting it to 4 mhz by trimming. * 3 : t a = +25c, v cc = 3.3 v * 4 : t a = + 8 5c, v cc = 5.5 v *5: when using the crystal oscillator of 4 mhz (including the current consumption of the oscillation circuit ) * 6 : when using the crystal oscillator of 32 khz (including the current consumption of the oscillation circuit )
document number: 002 - 05605 rev. *d page 61 of 109 mb9b100a series (vcc = avcc =2.7v to 5.5v, vss = avss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks typ* 2 max* 3 timer mode current i cct vcc main timer mode t a = + 25 ? c, when lvd is off 2.4 2.5 ma *1 , *4 t a = + 85 ? c, when lvd is off - 5.4 ma *1 , *4 sub timer mode t a = + 25 ? c, when lvd is off 110 300 a *1 , *5 t a = + 85 ? c, when lvd is off - 2.2 ma *1 , *5 stop mode current i cch stop mode t a = + 25 ? c, when lvd is off 50 200 a *1 t a = + 85 ? c, when lvd is off - 2 ma *1 *1: when a l l ports are fixed. * 2 : v cc =3.3 v * 3 : v cc =5.5 v *4: when using the crystal oscillator of 4 mhz(including the current consumption of the oscillation circuit ) * 5 : when using the crystal oscillator of 32 khz(including the current consumption of the oscillation circuit ) low - v oltage d etection current (v cc = 2.7v to 5.5v, v ss = 0v, t a = - 40c to + 8 5c) parameter symbol pin name conditions value unit remarks typ max low - voltage detection circuit (lvd) power supply current i cclvd vcc at operation for interrupt 2 10 a at not detect flash memory current (v cc = 2.7v to 5.5v, v ss = 0v, t a = - 40c to + 8 5c) parameter symbol pin name conditions value unit remarks typ max flash m emory w rite/ e rase current i ccflash vcc at write/erase 13 24 ma a/d converter current (v cc = av cc = 2.7v to 5.5v, v ss = av ss = avrl = 0v, t a = - 40c to + 8 5c) parameter symbol pin name conditions value unit remarks typ max power supply current i ccad avcc at 1unit operation 2.3 3.6 ma at stop 0.1 2 a reference power supply current i ccavrh avrh at 1unit operation avrh=5.5 v 2.2 3.0 ma at stop 0.03 0.6 a
document number: 002 - 05605 rev. *d page 62 of 109 mb9b100a series 12.3.2 pin characteristics (vcc = avcc = 2.7v to 5.5v, vss = avss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min typ max "h" level input voltage (hysteresis input) v ihs cmos hysteresis input pin, md0,1 - vcc 0.8 - vcc + 0.3 v "l" level input voltage (hysteresis input) v ils cmos hysteresis input pin, md0,1 - vss - 0.3 - vcc 0.2 v "h" level output voltage v oh 4ma type v cc ? 4.5 v i oh = - 4 ma vcc - 0.5 - vcc v v cc < 4.5 v i oh = - 2 ma 12ma type v cc ? 4.5 v i oh = - 12 ma vcc - 0.5 - vcc v v cc ? 4.5 v i oh = - 8 ma p80, p81 v cc ? 4.5 v i oh = - 25.3 ma vcc - 0.4 - vcc v v cc < 4.5 v i oh = - 13.4 ma "l" level output voltage v ol 4ma type v cc ? 4.5 v i ol = 4 ma vss - 0.4 v v cc < 4.5 v i ol = 2 ma 12ma type v cc ? 4.5 v i ol = 12 ma vss - 0.4 v v cc ? 4.5 v i ol = 8 ma p80, p81 v cc ? 4.5 v i ol = 19.7 ma vss - 0.4 v v cc < 4.5 v i ol = 11.9 ma input leak current i il - - - 5 - 5 a pull - up resistance value r pu pull - up pin v cc ? 4.5 v 25 50 100 k v cc ? 4.5 v 30 80 200 input capacitance c in other than vcc, vss, avcc, avss, avrh - - 5 15 pf
document number: 002 - 05605 rev. *d page 63 of 109 mb9b100a series 12.4 ac characteristics 12.4.1 main clock input characteristics (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max input frequency f ch x0 x1 vcc ? 4.5 v 4 48 mhz when crystal oscillator is connected vcc ? 4.5 v 4 20 vcc ? 4.5 v 4 48 mhz when using external clock vcc ? 4.5 v 4 20 input clock cycle t cylh vcc ? 4.5 v 20.83 250 ns when using external clock vcc ? 4.5 v 50 250 input clock pulse width - p wh /t cylh p wl /t cylh 45 55 % when using external clock input clock rise time and fall time t cf t cr - - 5 ns when using external clock internal operating clock * 1 frequency f cm - - - 80 mhz master clock f cc - - - 80 mhz base clock (hclk/fclk) f cp0 - - - 40 mhz apb0 bus clock* 2 f cp1 - - - 40 mhz apb1 bus clock* 2 f cp 2 - - - 40 mhz apb2 bus clock* 2 internal operating clock * 1 cycle time t cycc - - 12.5 - ns base clock (hclk/fclk) t cycp0 - - 25 - ns apb0 bus clock* 2 t cycp1 - - 25 - ns apb1 bus clock* 2 t cycp2 - - 25 - ns apb2 bus clock* 2 *1: for more information about each internal operating clock , see " c hapter 2 - 1 : clock " in " fm3 family peripheral manual ". *2: for about each apb bus which each peripheral is connected to , see " block di agram " in this data sheet.
document number: 002 - 05605 rev. *d page 64 of 109 mb9b100a series 12.4.2 sub clock input characteristics (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min typ max input frequency f cl x0a x1a - - 32.768 - khz when crystal oscillator is connected - 32 - 100 khz when using external clock input clock cycle t cyll - 10 - 31.25 s when using external clock input clock pulse width - p wh /t cyll p wl /t cyll 45 - 55 % when using external clock 12.4.3 built - in cr oscillation characteristics built - in high - speed cr (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol conditions value unit remarks min typ max clock frequency f crh t a = + 25 ? c 3.92 4 4.08 mhz when trimming * 1 t a = 0 ? c to + 70 ? c 3.84 4 4.16 t a = - 40 ? c to + 85 ? c 3.8 4 4.2 t a = - 40 ? c to + 85 ? c 3 4 6 when not trimming f requency stability time t crwt - - - 50 s * 2 *1: in the case of using the values in cr trimming area of flash memory at shipment for frequency trimming. *2: f requency stable time is time to stable of the frequency of the high - speed cr clock after the trim value is set. after setting the trim value, the period when the frequency stability time passes can use the high - speed cr clock as a source clock. built - in low - speed cr (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol conditions value unit remarks min typ max clock frequency f crl - 50 100 150 k hz
document number: 002 - 05605 rev. *d page 65 of 109 mb9b100a series 12.4.4 operating conditions of main pll (in the case of using main clock for input of pll) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol value unit remarks min typ max pll oscillation stabilization wait time (lock up time)* 1 t lock 100 - - s pll input clock frequency f plli 4 - 30 mh z pll multiple rate - 4 - 30 multiple pll macro oscillation clock frequency f pllo 60 - 120 mh z main pll clock frequency* 2 f clkpll - - 80 mh z *1: time from when the pll starts operating until the oscillation stabilizes. *2: for more information about main pll clock (clkpll), see "c hapter 2 - 1 : clock" in "fm3 family peripheral manual". 12.4.5 operating conditions of main pll (in the case of using built - in high speed cr) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol value unit remarks min typ max pll oscillation stabilization wait time (lock up time)* 1 t lock 100 - - s pll input clock frequency f plli 3.8 4 4.2 mh z pll multiple rate - 15 - 28 multiple pll macro oscillation clock frequency f pllo 57 - 120 mh z main pll clock frequency* 2 f clkpll - - 80 mh z *1: time from when the pll starts operating until the oscillation stabilizes. *2: for more information about main pll clock (clkpll), see "c hapter 2 - 1 : clock" in "fm3 family peripheral manual". note: ? make sure to input to the main pll source clock, the high - speed cr clock (clkhc) that the frequency has been trimmed. k divider pll input clock main pll pll macro oscillation clock m divider main pll clock (clkpll) n divider main pll connection high - speed cr clock (clkhc) main clock (clkmo)
document number: 002 - 05605 rev. *d page 66 of 109 mb9b100a series 12.4.6 reset input characteristics (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max reset input time t initx initx - 500 - ns 12.4.7 power - on reset timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name value unit remarks min max power supply rising time tr vcc 0 - ms power supply shut down time toff 1 - ms time until releasing power - on reset tprt 0.422 0.704 ms glossary ? vcc_minimum: minimum v cc of recommended operating conditions ? vd h _minimum: minimum release voltage of low - v oltage detection reset . see " 12.6 low - voltage detection characteristics " 0 . 2 v v d h _ m i n i m u m v c c _ m i n i m u m t p r t i n t e r n a l r s t v c c c p u o p e r a t i o n s t a r t r s t a c t i v e r e l e a s e t r 0 . 2 v 0 . 2 v t o f f
document number: 002 - 05605 rev. *d page 67 of 109 mb9b100a series 12.4.8 external bus timing asynchronous sram mode (vcc = 2.7v to 5. 5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max m oex min pulse width t oew moex vcc 4.5 v t hclk 1 - 3 - ns vcc ? 4.5 v moex ? ? address delay time t oel - av moex mad24 to 00 vcc 4.5 v 0 10 ns vcc ? 4.5 v 0 20 moex ? ? address delay time t oeh - ax moex mad24 to 00 vcc 4.5 v 0 10 ns vcc ? 4.5 v 0 20 moex ? ? mcsx ? delay time t oel - csl moex mcsx vcc 4.5 v 0 10 ns vcc ? 4.5 v moex ? ? mcsx ? delay time t oeh - c sh moex mcsx vcc 4.5 v 0 10 ns vcc ? 4.5 v data set up ? moe x ? time t ds - oe moex mdata15 to 0 vcc 4.5 v 20 - ns vcc ? 4.5 v 38 - moex ? ? data hold time t dh - oe moex mdata15 to 0 vcc 4.5 v 0 - ns vcc ? 4.5 v m cs x ? ? mwex ? delay time t csl - wel mcsx mwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 10 - mwex ? ? mcsx ? delay time t weh - csh mcsx mwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 10 - address ? mwex ? delay time t av - wel mwex mad24 to 00 vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mwex ? ? address delay time t weh - ax mwex mad24 to 00 vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mwex ? ? mdqm ? delay time t wel - dqml mwex mdqm0 to 1 vcc 4.5 v 0 5 ns vcc ? 4.5 v 0 10 mwex ? ? mdqm ? delay time t weh - dqmh mwex mdqm0 to 1 vcc 4.5 v 0 5 ns vcc ? 4.5 v 0 10 m wex min pulse width t wew mwex vcc 4.5 v t hclk 1 - 3 - ns vcc ? 4.5 v mwex ? ? data delay time t wel - dv mwex mdata15 to 0 vcc 4.5 v - 5 5 ns vcc ? 4.5 v - 15 15 mwex ? ? data delay time t weh - dx mwex mdata15 to 0 vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 15 - note: ? w hen the external load capacitance c l = 50 pf.
document number: 002 - 05605 rev. *d page 68 of 109 mb9b100a series v il v ih v oh mcsx0 to 7 mad24 to 00 moex mdata15 to 0 t oew v ol v ol v oh t oel - av v ol v oh t oel - csl v ol v oh v ih v il t ds - oe t dh - oe t oeh - ax read sram read hclk t cyc v oh v oh t oeh - csh
document number: 002 - 05605 rev. *d page 69 of 109 mb9b100a series mwex mdata15 to 0 v oh v ol v ol v oh write mcsx0 to 7 mad24 to 00 v ol v ol v oh v ol v oh sram write hclk t cyc v oh mdqm0 to 1 v oh t wel - dqml v ol v ol v oh t weh - dx t weh - ax t csl - wel t wew t weh - csh t weh - dqmh t wel - dv t av - wel
document number: 002 - 05605 rev. *d page 70 of 109 mb9b100a series nand flash mode (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max m nrex min pulse width t nrew mnrex v cc 4.5 v t hclk 1 - 3 - ns vcc ? 4.5 v data set up ? mnre x ? time t ds - nre mnrex mdata15 to 0 vcc 4.5 v 20 - ns vcc ? 4.5 v 38 - m nrex ? ? d ata hold time t dh - nre mnrex mdata15 to 0 vcc 4.5 v 0 - ns vcc ? 4.5 v 0 - mnale ? ? mnwex delay time t aleh - nwel mnale mnwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mnwex ? ? mnale delay time t nweh - alel mnale mnwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mncle ? ? mnwex delay time t cleh - nwel mncle mnwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mnwex ? ? mncle delay time t nweh - clel mncle mnwex vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - mnwex min pulse width t nwew mnwex vcc 4.5 v t hclk 1 - 3 - ns vcc ? 4.5 v mnwex ? ? data delay time t nwel - dv mnwex mdata15 to 0 vcc 4.5 v - 5 + 5 ns vcc ? 4.5 v - 15 +15 mnwex ? ? data delay time t nweh - dx mnwex mdata15 to 0 vcc 4.5 v t hclk 1 - 5 - ns vcc ? 4.5 v t hclk 1 - 1 5 - note : ? w hen the external load capacitance c l = 50 pf.
document number: 002 - 05605 rev. *d page 71 of 109 mb9b100a series v il v ih mnrex mdata15 to 0 v ol v oh v ih v il t ds - nre t dh - nre read nand flash read t nrew hclk t cyc v oh v oh mdata15 to 0 v oh v ol v ol v oh write nand flash write hclk t cyc mnwex v oh v ol t nwew v ol v oh t nweh - dx v oh v ol mncle mnale t aleh - nwel t nwel - dv t nweh - alel t cleh - nwel t nweh - clel
document number: 002 - 05605 rev. *d page 72 of 109 mb9b100a series 12.4.9 base timer input timing timer input timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max input pulse width t tiwh t tiwl tioan/tiobn (when using as eck,tin) - 2 t cycp - ns trigger input timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max input pulse width t trgh t trgl tioan/tiobn (when using as tgin) - 2 t cycp - ns note: ? t cycp indicates the apb bus clock cycle time. about the apb bus number which the base timer is connected to, see " block di agram " in this data sheet. t tiwh v ihs v ihs v ils v ils t tiw l v ihs v ils tgin t trgh v ihs v ils t trgl
document number: 002 - 05605 rev. *d page 73 of 109 mb9b100a series 12.4.10 csio/uart timing csio (spi = 0, scinv = 0) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions vcc ? 4.5 v vcc 4.5 v unit min max min max b aud rate - - - - 8 - 8 mbps serial clock cycle time t scyc sck x master mode 4t cycp - 4 t cycp - ns sck ? ? sot delay time t slovi sckx sotx - 30 +30 - 20 + 20 ns sin ? sck ? setup time t ivshi sckx sinx 50 - 30 - ns sck ? ? sin hold time t shixi sckx sinx 0 - 0 - ns serial clock " l" pulse width t slsh sckx slave mode 2 t cycp - 10 - 2 t cycp - 10 - ns serial clock " h" pulse width t shsl sckx t cycp + 10 - t cycp + 10 - ns sck ? ? sot delay time t slove sckx sotx - 50 - 30 ns sin ? sck ? setup time t ivshe sckx sinx 10 - 10 - ns sck ? ? sin hold time t shixe sckx sinx 20 - 20 - ns sck fall time tf sckx - 5 - 5 ns sck rise time tr sckx - 5 - 5 ns notes: ? the above characteristics apply to clk synchronous mode. ? t cycp indicates the apb bus clock cycle time. about the apb bus number which multi - function serial is connected to , see " block di agram " in this data sheet. ? these characteristics only guarantee the same relocate port number. for example, the combination of sckx_0 and sotx_1 is not guaranteed. ? w hen the external load capacitanc e c l = 50 pf.
document number: 002 - 05605 rev. *d page 74 of 109 mb9b100a series master mode slave mode sck sot sin sck sot sin t scyc v oh v oh v ol v ol v ol v ih v il v ih v il t slovi t ivshi t shixi t slsh t shsl v ih t f tr v ih v oh v ih v il v il v ol v ih v il v ih v il t slove t ivshe t shixe
document number: 002 - 05605 rev. *d page 75 of 109 mb9b100a series csio (spi = 0, scinv = 1) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions vcc ? 4.5 v vcc 4.5 v unit min max min max b aud rate - - - - 8 - 8 mbps serial clock cycle time t scyc sckx master mode 4 t cycp - 4 t cycp - ns sck ? ? sot delay time t shovi sckx sotx - 30 +30 - 20 + 20 ns sin ? sck ? setup time t ivsli sckx sinx 50 - 30 - ns sck ? ? sin hold time t slixi sckx sinx 0 - 0 - ns serial clock " l" pulse width t slsh sckx slave mode 2 t cycp - 10 - 2 t cycp - 10 - ns serial clock " h" pulse width t shsl sckx t cycp + 10 - t cycp + 10 - ns sck ? ? sot delay time t shove sckx sotx - 50 - 30 ns sin ? sck ? setup time t ivsle sckx sinx 10 - 10 - ns sck ? ? sin hold time t slixe sckx sinx 20 - 20 - ns sck fall time tf sckx - 5 - 5 ns sck rise time tr sckx - 5 - 5 ns notes: ? the above characteristics apply to clk synchronous mode. ? t cycp indicates the apb bus clock cycle time. ? about the apb bus number which multi - function serial is connected to , see " block di agram " in this data sheet. ? these characteristics only guarantee the same relocate port number. for example, the combination of sckx_0 and sotx_1 is not guaranteed. ? w hen the external load capacitanc e c l = 50 pf.
document number: 002 - 05605 rev. *d page 76 of 109 mb9b100a series ? master mode slave mode sck sot sin sck sot sin t scyc v oh v oh v oh v ol v ol v ih v il v ih v il t shovi t ivsli t slixi t shsl t slsh v ih tf tr v ih v oh v il v il v il v ol v ih v il v ih v il t shove t ivsle t slixe
document number: 002 - 05605 rev. *d page 77 of 109 mb9b100a series csio (spi = 1, scinv = 0 ) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions vcc ? 4.5 v vcc 4 .5 v unit min max min max b aud rate - - - - 8 - 8 mbps serial clock cycle time t scyc sckx master mode 4 t cycp - 4 t cycp - ns sck ? ? sot delay time t shovi sckx sotx - 30 +30 - 20 + 20 ns sin ? sck ? setup time t ivsli sckx sinx 50 - 30 - ns sck ? ? sin hold time t slixi sckx sinx 0 - 0 - ns sot ? sck ? delay time t sovli sckx sotx 2 t cycp - 30 - 2 t cycp - 30 - ns serial clock " l" pulse width t slsh sckx slave mode 2 t cycp - 10 - 2 t cycp - 10 - ns serial clock " h" pulse width t shsl sckx t cycp + 10 - t cycp + 10 - ns sck ? ? sot delay time t shove sckx s ot x - 50 - 30 ns sin ? sck ? setup time t ivsle sckx sinx 10 - 10 - ns sck ? ? sin hold time t slixe sckx sinx 20 - 20 - ns sck fall time tf sckx - 5 - 5 ns sck rise time tr sckx - 5 - 5 ns notes: ? the above characteristics apply to clk synchronous mode. ? t cycp indicates the apb bus clock cycle time. ? about the apb bus number which multi - function serial is connected to , see " block di agram " in this data sheet. ? these characteristics only guarantees the same relocate port number. for example, the combination of sckx_0 and sotx_1 is not guaranteed. ? w hen the external load capacitan ce c l = 50 pf.
document number: 002 - 05605 rev. *d page 78 of 109 mb9b100a series master mode slave mode *: changes when writing to tdr register sck sot sin sck sot sin t sovli t scyc t shovi v ol v ol v oh v oh v ol v oh v ol v ih v il v ih v il t ivsli t slixi tf tr t slsh t shsl t shove v il v il v ih v ih v ih v oh * v ol v oh v ol v ih v il v ih v il t ivsle t slixe
document number: 002 - 05605 rev. *d page 79 of 109 mb9b100a series csio (spi = 1, scinv = 1 ) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions vcc ? 4.5 v vcc 4.5 v unit min max min max b aud rate - - - - 8 - 8 mbps serial clock cycle time t scyc sckx master mode 4 t cycp - 4 t cycp - ns sck ? ? sot delay time t slovi sckx sotx - 30 +30 - 20 + 20 ns sin ? sck ? setup time t ivshi sckx sinx 50 - 30 - ns sck ? ? ? sin hold time t shixi sckx sinx 0 - 0 - ns sot ? sck ? delay time t sovhi sckx sotx 2 t cycp - 30 - 2 t cycp - 30 - ns serial clock " l" pulse width t slsh sckx slave mode 2 t cycp - 10 - 2 t cycp - 10 - ns serial clock " h" pulse width t shsl sckx t cycp + 10 - t cycp + 10 - ns sck ? ? sot delay time t slove sckx s ot x - 50 - 30 ns sin ? sck ? setup time t ivshe sckx sinx 10 - 10 - ns sck ? ? sin hold time t shixe sckx sinx 20 - 20 - ns sck fall time tf sckx - 5 - 5 ns sck rise time tr sckx - 5 - 5 ns notes: ? the above characteristics apply to clk synchronous mode. ? t cycp indicates the apb bus clock cycle time. ? about the apb bus number which multi - function serial is connected to , see " block di agram " in this data sheet. ? these characteristics only guarantee the same relocate port number. for example, the combination of sckx_0 and sotx_1 is not guaranteed. ? w hen the external load capacitanc e c l = 50 pf.
document number: 002 - 05605 rev. *d page 80 of 109 mb9b100a series master mode slave mode uart external clock input (ext = 1 ) (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol conditions min max unit remarks serial clock " l" pulse width t slsh c l = 50 pf t cycp + 10 - ns serial clock " h" pulse width t shsl t cycp + 10 - ns sck fall time tf - 5 ns sck rise time tr - 5 ns t shsl v i l v i l v i l v ih v ih v ih tr tf t slsh sck sot sin sck sot sin s ck t scyc t slovi v ol v oh v oh v oh v ol v oh v ol v ih v il v ih v il t ivshi t shixi t sovhi t s h s l t r t s l s h t s l o v e v i l v i l v i l v i h v i h v i h v o h v o l v o h v o l v i h v i l v i h v i l t i v s h e t s h i x e t f
document number: 002 - 05605 rev. *d page 81 of 109 mb9b100a series 12.4.11 external input timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max input pulse width t inh t inl adtg - 2 t cycp * - ns a/d converter trigger input frckx free - run timer input clock icxx input capture dttixx - 2 t cycp * - ns wave form generator intxx, nmix except timer mode, stop mode 2 t cycp + 100 * - ns external interrupt nmi timer mode, stop mode 500 - ns *: t cycp indicates the apb bus clock cycle time. about the apb bus number which the a/d converter, multi - function timer , external interrupt are connected to , see " block di agram " in this data sheet. t inh v ils v ihs v ihs v ils t inl
document number: 002 - 05605 rev. *d page 82 of 109 mb9b100a series 12.4.12 quadrature position/revolution counter timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol conditions value unit min max ain pin "h" width t ahl - 2 t cycp * - ns ain pin "l" width t all - bin pin "h" width t bhl - bin pin "l" width t bll - bin rise time from ain pin "h" level t aubu pc_mode2 or pc_ m ode3 ain fall time from bin pin "h" level t buad pc_mode2 or pc_mode3 bin fall time from ain pin "l" level t adbd pc_mode2 or pc_mode3 ain rise time from bin pin "l" level t bdau pc_mode2 or pc_mode3 ain rise time from bin pin "h" level t buau pc_mode2 or pc_mode3 bin fall time from ain pin "h" level t aubd pc_mode2 or pc_mode3 ain fall time from bin pin "l" level t bdad pc_mode2 or pc_mode3 bin rise time from ain pin "l" level t adbu pc_mode2 or pc_mode3 zin pin "h" width t zhl qcr:cgsc="0" zin pin "l" width t zll qcr:cgsc="0" ain/bin rise and fall time from determined zin level t zabe qcr:cgsc="1" determined zin level from ain/bin rise and fall time t abez qcr:cgsc="1" *: t cycp indicates the apb bus clock cycle time. about the apb bus number which the quadrature position/revolution counter is connected to , see " block di agram " in this data sheet. ain bin t aubu t buad t adbd t bdau t ahl t all t bhl t bll
document number: 002 - 05605 rev. *d page 83 of 109 mb9b100a series zin zin ain/bin bin t buau t aubd t bdad t adbu t bhl t bll t ahl t all ain
document number: 002 - 05605 rev. *d page 84 of 109 mb9b100a series 12.4.13 i 2 c timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol conditions standard - mode fast - mode unit remarks min max min max scl clock frequency f scl c l = 50 pf, r = (vp/i ol )* 1 0 100 0 400 khz (repeated) start condition hold time sda ? ? scl ? t hdsta 4.0 - 0.6 - s sclclock " l " width t low 4.7 - 1.3 - s sclclock " h " width t high 4.0 - 0.6 - s (repeated) start setup time scl ? ? sda ? t susta 4.7 - 0.6 - s data hold time scl ? ? sda ? ? t hddat 0 3.45* 2 0 0.9* 3 s data setup time sda ? ? ? scl ? t sudat 250 - 100 - ns stop condition setup time scl ? ? sda ? t susto 4.0 - 0.6 - s bus free time between "stop condition" and "start condition" t buf 4.7 - 1.3 - s noise filter t sp - 2 t cycp * 4 - 2 t cycp * 4 - ns *1: r and c represent the pull - up resistance and load capacitance of the scl and sda lines, respectively. vp indicates the power supply voltage of the pull - up resistance and i ol indicates v ol guaranteed current. *2: the maximum t hddat must satisfy that it doesn't extend at least "l" period (t low ) of device's scl signal. *3: fast - mode i 2 c bus device can be used on s tandard - mode i 2 c bus system as long as the device satisfies the requirement of "t sudat 250 ns". *4: t cycp is the apb bus clock cycle tim e. about the apb bus number that i 2 c is connected to, see " block di agram " in this data sheet. to use standard - mode, set the apb bus clock at 2 mhz or more. to use fast - mode, set the apb bus clock at 8 mhz or more. sda s cl
document number: 002 - 05605 rev. *d page 85 of 109 mb9b100a series 12.4.14 etm timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max data hold t etmh traceclk traced3 - 0 vcc 4.5 v 2 9 ns vcc ? 4.5 v 2 15 traceclk frequency 1/t trace traceclk vcc 4.5 v - 50 mhz vcc < 4.5 v - 32 mhz traceclk clock cycle time t trace vcc 4.5 v 20 - ns vcc < 4.5 v 31.25 - ns note: ? w hen the external load capacitance c l = 50 pf. hclk traceclk traced[3:0]
document number: 002 - 05605 rev. *d page 86 of 109 mb9b100a series 12.4.15 jtag timing (vcc = 2.7v to 5.5v, vss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name conditions value unit remarks min max tms,tdi setup time t jtags tck tms,tdi vcc 4.5 v 15 - ns vcc ? 4.5 v tms,tdi hold time t jtagh tck tms,tdi vcc 4.5 v 15 - ns vcc ? 4.5 v tdo delay time t jtagd tck tdo vcc 4.5 v - 25 ns vcc ? 4.5 v - 45 note: ? w hen the external load capacitance c l = 50 pf. tck tms/ tdi tdo
document number: 002 - 05605 rev. *d page 87 of 109 mb9b100a series 12.5 12 - bit a/d converter electrical characteristics for the a/d converter. (vcc = avcc = 2.7v to 5.5v, vss = avss = 0v, t a = - 40 ? c to + 85 ? c ) parameter symbol pin name value unit remarks min typ max resolution - - - - 12 bit integral nonlinearity - - - 2 4.5 lsb avrh = 2.7 v to 5.5 v differential nonlinearity - - - 2 2.5 lsb zero transition voltage v zt anxx - 5 20 mv full - scale transition voltage v fst anxx - avrh 10 avrh 20 mv conversion time - - 1.0* 1 - - s avcc 4.5 v 2.666* 1 - - avcc < 4.5 v sampling time ts - *2 - - ns avcc 4.5 v *2 - - avcc < 4.5 v compare clock cycle *3 tcck - 55.5 - 10000 ns avcc 4.5 v 166.6* 4 avcc < 4.5 v state transition time to operation permission tstt - - - 2.5 s analog input capacity c ain - - - 14.5 pf analog input resistance r ain - - - 0.93 k avcc 4.5 v 2.04 avcc < 4.5 v interchannel disparity - - - - 4 lsb analog port input leak current - anxx - - 5 a analog input voltage - anxx av ss - avrh v reference voltage - avrh 2.7 - av cc v *1: the conversion time is the value of sampling time (ts) + compare time (tc). the condition of the minimum conversion time is the following. avcc 4.5 v, hclk = 72 mhz sampling time: 0.222 s compare time: 0.778 s avcc < 4.5 v, hclk = 54 mhz sampling time: 0.333 s compare time: 2.333 s ensure that it satisfies the value of the sampling time (ts) and compare clock cycle (tcck). for setting of the sampling time and compare clock cycle, see " c hapter 1 - 1 : a/d converter " in " fm3 family peri pheral manual analog macro part ". the register s setting of the a/d converter are reflected in the operation according to the apb bus clock timing. the sampling clock and compare clock is generated from the base clock (hclk). about the apb bus number which the a/d converter is connected to, see " block di agram " in this data sheet. *2: a necessary sampling time changes by external impedance. ensure that it set the sampling time to satisfy ( equation 1 ) *3: the compare time ( tc ) is the value of ( equation 2) *4: when 12 - bit a/d converter is used at avcc<4.5 v, there is a limitation as follows. please set the hclk frequency under 54 mhz.
document number: 002 - 05605 rev. *d page 88 of 109 mb9b100a series (equation 1) ts ( r ain + rext ) c ain 9 ts: sampling time r ain : i nput resistance of a/d = 0.93k 4.5 v av cc 5.5 v i nput resistance of a/d = 2.04k 2.7 v av cc < 4 .5 v c ain : i nput capacity of a/d = 14.5pf 2.7 v av cc 5.5 v rext: output impedance of external circuit (equation 2 ) tc = tcck 14 tc: compare time tcck: com p are clock cycle r ain c ain analog signal source rext an xx analog input pin c omparator
document number: 002 - 05605 rev. *d page 89 of 109 mb9b100a series definition of 1 2 - bit a/d converter terms ? resolution : analog variation that is recognized by an a/d converter. ? integral nonl inearity : deviation of the line between the zero - transition point (0b000000000000 0b000000000001) and the full - scale transition point (0b111111111110 0b111111111111) from the actual conversion characteristics. ? differential non linearity : deviation from the ideal value of the input voltage that is required to change t he output code by 1 lsb. integral nonlinearity of digital output n = v nt - {1lsb (n - 1) + v z t } [lsb] 1lsb differential nonlinearity of digital output n = v (n + 1) t - v nt - 1 [lsb] 1lsb 1lsb = v fst C v z t 4094 n: a/d converter digital output value. v z t : voltage at which the digital output changes from 0x000 to 0x001. v fst : voltage at which the digital output changes from 0xffe to 0xfff. v nt : voltage at which the digital output changes from 0x(n ? 1) to 0xn. integral nonl inearity d ifferential non linearity digital output digital output actual conversion characteristics actual conversion characteristics ideal characteristics (actually - measured value) actual conversion characteristics actual conversion characteristics (actually - measured value) (actually - measured value) ideal characteristics (actually - measured value) analog input analog input (actually - measured value) 0x001 0x002 0x003 0x004 0x f fd 0x f fe 0x f ff av ss avrh av ss avrh 0x(n - 2) 0x(n - 1) 0x(n+1) 0xn {1 lsb(n - 1) + v zt } v nt v fst v zt v nt v (n+1)t
document number: 002 - 05605 rev. *d page 90 of 109 mb9b100a series 12.6 low - voltage detection characteristics 12.6.1 low - voltage detection reset ( t a = - 40 ? c to + 85 ? c ) parameter symbol conditions value unit remarks min typ max detected voltage vdl - 2.20 2.40 2.60 v when voltage drops released voltage vdh - 2.30 2.50 2.70 v when voltage rises 12.6.2 interrupt of low - voltage detection ( t a = - 40 ? c to + 85 ? c ) parameter symbol conditions value unit remarks min typ max detected voltage vdl svhi = 0000 2.58 2.8 3.02 v when voltage drops released voltage vdh 2.67 2.9 3.13 v when voltage rises detected voltage vdl svhi = 0001 2.76 3.0 3.24 v when voltage drops released voltage vdh 2.85 3.1 3.34 v when voltage rises detected voltage vdl svhi = 0010 2.94 3.2 3.45 v when voltage drops released voltage vdh 3.04 3.3 3.56 v when voltage rises detected voltage vdl svhi = 0011 3.31 3.6 3.88 v when voltage drops released voltage vdh 3.40 3.7 3.99 v when voltage rises detected voltage vdl svhi = 0100 3.40 3.7 3.99 v when voltage drops released voltage vdh 3.50 3.8 4.10 v when voltage rises detected voltage vdl svhi = 0111 3.68 4.0 4.32 v when voltage drops released voltage vdh 3.77 4.1 4.42 v when voltage rises detected voltage vdl svhi = 1000 3.77 4.1 4.42 v when voltage drops released voltage vdh 3.86 4.2 4.53 v when voltage rises detected voltage vdl svhi = 1001 3.86 4.2 4.53 v when voltage drops released voltage vdh 3.96 4.3 4.64 v when voltage rises lvd stabilization wait time t lvdw - - - 2040 t cycp * s *: t cycp indicates the apb2 bus clock cycle time.
document number: 002 - 05605 rev. *d page 91 of 109 mb9b100a series 12.7 flash memory write/erase characteristics 12.7.1 write / erase time ( vcc = 2.7v to 5.5v , t a = - 40 ? c to + 85 ? c ) parameter value unit remarks typ* max* sector erase time large sector 1.6 7.5 s in cludes write time prior to internal erase small sector 0.4 2.1 half word (16 bit) write time 25 400 s not including system - level overhead time. chip erase time 16 76.8 s in cludes write time prior to internal erase *: the typical value is immediately after shipment , the maxim u m value is guarantee value under 100,000 cycle of erase/write . 12.7.2 erase/write cycles and data hold time erase/write cycles (cycle) data hold time (year ) remarks 1,000 20 * 10,000 10 * 100,000 5 * *: at average + 85 ? c
document number: 002 - 05605 rev. *d page 92 of 109 mb9b100a series 12.8 return time from low - power consumption mode 12.8.1 return factor: interrupt the return time from low - power consumption mode is indicated as follows. it is from receiving the return factor to starting the program operation. return c ount t ime ( v cc = 2.7v to 5.5v , t a = - 40 c to + 85 c ) parameter symbol value unit remarks typ max* sleep mode ticnt t cycc ns high - speed cr timer mode, main timer mode, pll timer mode 33 100 s low - speed cr timer mode 445 1061 s sub timer mode 445 1061 s stop mode 445 1061 s *: the maximum value depends on the accuracy of built - in cr . operation example of return from l ow - p ower consumption mode (by external interrupt*) *: external interrupt is set to detecting fall edge. e x t . i n t t i c n t i n t e r r u p t f a c t o r a c c e p t c p u o p e r a t i o n s t a r t a c t i v e i n t e r r u p t f a c t o r c l e a r b y c p u
document number: 002 - 05605 rev. *d page 93 of 109 mb9b100a series operation example of return from low - power consumption mode (by internal resource interrupt*) *: internal resource interrupt is not included in return factor by the kind of low - power consumption mode. notes: ? the return factor is different in each l ow - p ower consumption modes. see "c hapter 6 : low power consumption mode" and "operations of standby modes" in fm3 family peripheral manual about the return factor from l ow - p ower consumption mode. ? when interrupt recov eries, the operation mode that cpu recoveries depends on the state before the low - power consumption mode transition. see "chapter 6: low power consumption mode" in "fm3 family peripheral manual". i n t e r n a l r e s o u r c e i n t t i c n t i n t e r r u p t f a c t o r a c c e p t c p u o p e r a t i o n s t a r t a c t i v e i n t e r r u p t f a c t o r c l e a r b y c p u
document number: 002 - 05605 rev. *d page 94 of 109 mb9b100a series 12.8.2 return factor: reset the return time from low - power consumption mode is indicated as follows. it is from releasing reset to starting the program operation. return c ount t ime ( v cc = 2.7v to 5.5v , t a = - 40 c to + 85 c ) parameter symbol value unit remarks typ max* sleep mode trcnt 82 181 s high - speed cr timer mode, main timer mode, pll timer mode 82 181 s low - speed cr timer mode 431 1003 s sub timer mode 431 1003 s stop mode 431 1003 s *: the maximum value depends on the accuracy of built - in cr. operation example of return from l ow - p ower consumption mode (by initx) i n i t x t r c n t i n t e r n a l r s t c p u o p e r a t i o n s t a r t r s t a c t i v e r e l e a s e
document number: 002 - 05605 rev. *d page 95 of 109 mb9b100a series operation example of return from low power consumption mode (by internal resource reset*) *: internal resource reset is not included in return factor by the kind of low - power consumption mode. notes: ? the return factor is different in each low - power consumption modes. see "chapter 6: low power consumption mode" and "operations of standby modes" in fm3 family peripheral manual. ? when interrupt recoveries, the operation mode that cpu recoveries depends on the state before the low - power consumption mode transition. see "chapter 6: low power consumption mode" in "fm3 family peripheral manual". ? the time during the power - on reset/low - voltage detection reset is exc luded. see "(6) power - on reset timing in 4. ac characteristics in electrical characteristics" for the detail on the time during the power - on reset/low - voltage detection reset. ? when in recovery from reset, cpu changes to the high - speed cr run mode. when u sing the main clock or the pll clock, it is necessary to add the main clock oscillation stabilization wait time or the main pll clock stabilization wait time. ? the internal resource reset means the watchdog reset and the csv reset. i n t e r n a l r e s o u r c e r s t t r c n t i n t e r n a l r s t c p u o p e r a t i o n s t a r t r s t a c t i v e r e l e a s e
document number: 002 - 05605 rev. *d page 96 of 109 mb9b100a series 13. example of characteristic power supply current (pll run mode, pll sleep mode) power supply current (sub run mode) power supply current (sub sleep mode) icc normal operation(pll) temperature characteristics vcc:5.5v, cpu:80mh, peripheral:40mh,flash 2wait 0 10 20 30 40 50 60 70 80 90 100 110 120 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ] power supply current [ma] iccs sleep operation(pll) temperature characteristics vcc:5.5v, peripheral:40mh 0 10 20 30 40 50 60 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[ ] power supply current [ma] icc normal operation(sub oscillation) temperature characteristics vcc:5.5v, cpu/peripheral:32khz 0 50 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] icc normal operation(sub oscillation) temperature characteristics(semi-log) vcc:5.5v, cpu/peripheral:32khz 1 10 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] (log) iccs sleep operation(sub oscillation) temperature characteristics vcc:5.5v, peripheral:32khz 0 50 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] iccs sleep operation(sub oscillation) temperature characteristics(semi-log) vcc:5.5v, peripheral:32khz 1 10 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] (log)
document number: 002 - 05605 rev. *d page 97 of 109 mb9b100a series power supply current (sub timer mode) power supply current (stop mode) i cct timer mode(sub oscillation) temperature characteristics vcc:5.5v, lvd is off 0 50 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] i cct timer mode(sub oscillation) temperature characteristics(semi-log) vcc:5.5v, lvd is off 1 10 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] (log) i cch stop mode (sub oscillation) temperature characteristics vcc:5.5v, lvd is off 0 50 100 150 200 250 300 350 400 450 500 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] i cch stop mode (sub oscillation) temperature characteristics(semi-log) vcc:5.5v, lvd is off 1 10 100 1000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 temperature ta[] power supply current [a] (log)
document number: 002 - 05605 rev. *d page 98 of 109 mb9b100a series 14. ordering information part n umber on - chip flash m emory on - chip sram package packing mb9bf102napmc - g - jne2 128 kbyte 16 kbyte plastic ? lqfp(0.5mm pitch),100 - pin (lqi100) tray mb9bf104napmc - g - jne2 256 kbyte 32 kbyte mb9bf104napmc - g - une1 mb9bf105napmc - g - jne2 384 kbyte 48 kbyte mb9bf106napmc - g - une 1 512 kbyte 64 kbyte mb9bf106napmc - g - une2 mb9bf102rapmc - g - jne2 128 kbyte 16 kbyte plastic ? lqfp(0.5mm pitch),120 - pin (lqm120) mb9bf104rapmc - g - jne2 256 kbyte 32 kbyte mb9bf105rapmc - g - jne2 384 kbyte 48 kbyte mb9bf106rapmc - g - une1 512 kbyte 64 kbyte mb9bf106rapmc - g - une2 mb9bf102nabgl - gk6e1 128 kbyte 16 kbyte plastic ? pfbga(0.8mm pitch),112 - pin (lbc112) mb9bf104nabgl - gk6e1 256 kbyte 32 kbyte mb9bf105nabgl - gk6e1 384 kbyte 48 kbyte mb9bf106nabgl - gk6e1 512 kbyte 64 kbyte
document number: 002 - 05605 rev. *d page 99 of 109 mb9b100a series 15. package dimensions package type package code lqfp 100 lqi100 002 - 11500 * a n o t e s : 1 . a ll d i m e n s io n s a r e i n m i ll i m e t e r s . 2. d a t u m pla n e h i s lo c a t e d a t t h e bot t o m of t h e mold partin g li n e coi n c i d e n t w i t h w h e r e t h e l e a d e x i t s t h e body . 3 . d a tums a - b a n d d t o b e d e t e rmi n e d a t d a t u m p l a n e h . 4. to b e d e t e r m i n e d a t s e a t i n g plane c . 5 . d i m e n sio n s d1 a nd e 1 d o n ot i nc l ud e m ol d p r o t ru si o n . allowable protrusi o n is 0 . 25 mm p r e si d e . d i m e n s i o n s d 1 a n d e 1 i n c l u d e m o l d m i s m a t c h a n d a r e d e t e rmine d a t d a t u m plane h . 6 . d e t a i l s o f p i n 1 i d e n t i f i e r a r e o p t i o n a l b u t m u s t be l o c ate d w i t h i n th e zo n e i n d i c a t e d . 7 . r e g a r d l e s s of t h e r e l a t i v e s i z e o f t h e u p p e r a n d l o w e r b o d y s e c t i o n s . d i m e n s i o n s d 1 a n d e 1 a r e d e t e r m i n e d a t t h e larges t f e a t u r e o f t h e b o d y e x c l u s i v e o f m o l d f l a s h a n d g a te burrs . b u t i n clu d i n g a n y m i s m a t c h b e t w e e n t h e u p p e r a nd lowe r s e c t ion s of t h e mol d e r b o dy . 8 . d i m e n s i o n b d o e s n o t i n c l u d e d a m b a r p r o t r u s i o n . t h e d a mba r p r o t r u s i o n ( s ) s h a l l n o t c a u s e t h e l e a d w i d t h to e x c e e d b m a x i m u m b y m o r e t h a n 0 . 0 8 m m . d a m b a r c a n n o t b e l o cated o n t h e l o w e r r a d i u s o r t h e l e a d f oot . 9. t h e s e d i m e n s ion s a p p l y t o t h e fla t s e c t i o n of the lea d b e t w e e n 0 . 10m m a n d 0.25 m m f r o m t h e lead tip . 10 . a 1 i s d e f i n e d a s t h e d i s t a n c e f r om t h e s e a t i n g p l a n e t o t h e low e s t p o i n t of t h e p a c k age body . d im e n s io n s symbol m in . n o m . max . a 1.7 0 a1 0.0 5 0.1 5 b 0 .1 5 0 .2 7 c 0 .0 9 0 .2 0 d 1 6 . 00 bsc d 1 1 4 .00 bs c e 0 . 50 bsc e e1 l 0 .4 5 0 .6 0 0 .7 5 l1 0.3 0 0.5 0 0.7 0 1 6. 00 bsc 1 4. 00 bsc a a 1 0.25 0.0 8 c 1 100 d 1 d e 1 e e 4 4 0.0 8 c a - b d 7 5 seat i n g pla n e 0.2 0 c a - b d 0.1 0 c a - b d b se c t io n a-a ' c 9 a a ' 5 7 5 7 3 3 6 8 1 0 2 2 l1 l b d 1 d e 1 e 4 4 5 7 5 7 25 26 50 51 75 76 side v i ew top v i ew b o tt o m vie w d e t a il a 1 25 26 50 5 7 1 5 100 76 package ou t line, 1 00 le a d l q f p 14.0x14.0x1.7 mm lq i 100 r ev * a
document number: 002 - 05605 rev. *d page 100 of 109 mb9b100a series package type package code lqfp 120 lqm120 002 - 1 6172 ** m i n . n o m . m ax . 0 7 . 1 a a 1 0 . 0 5 0 . 1 5 b 0 .1 7 0 .2 2 0 .2 7 c 0 . 1 1 5 0 . 1 9 5 d 1 8 . 0 0 b s c d 1 1 6 . 0 0 b s c e 0 . 5 0 bs c e e 1 l 0 .4 5 0 .6 0 0 .7 5 1 8 . 0 0 b s c 1 6 . 0 0 b s c d i m e n s io n s s y m b o l 0 8 s i d e vie w b o tt o m vie w t o p v i e w 1 120 d 1 d e e e 1 0.20 c a - b d 0.10 c a - b d 0.08 c a - b d b 0.08 c s eati n g pla n e a a' a a 1 0.25 1 0 l b s ec t i on a - a' c 9 4 5 7 3 4 5 7 3 8 7 5 2 2 6 30 31 60 61 90 91 1 30 31 60 0 9 1 6 91 package ou t line, 1 20 le a d l q f p 18 . 0x18 . 0x1 . 7 m m lq m 120 r ev * *
document number: 002 - 05605 rev. *d page 101 of 109 mb9b100a series package type package code pfbga 112 lbc112 002 - 1 3225 ** n i s t h e n u m b e r o f p o p u l a t e d s o l d e r b a l l p o s i t i o n s f o r m a trix w hen t here i s an even number of s o l d e r ba ll s i n t h e o u t e r r o w , w hen t here i s an o dd number of s o l d e r ba ll s i n t h e o u t e r r o w , d e f i n e t h e positio n of t h e c e n t e r s o ld e r b a ll in t h e o u t e r r o w . " s d " and " se " are measured w i th r espe c t to d a t u m s a a nd b a nd s y m b o l " m e " i s t h e b a l l m a t r i x s i z e i n t h e " e " d i r e c t io n . s y m b o l " m d " i s t h e b a l l m a t r i x s i z e i n t h e " d " d i r e c t io n . "e" represents the sol d e r ba ll g r i d p i t ch . di m e n s i on " b " i s m e a s u r e d a t t h e m a x i m u m b a l l di a m e t e r in a so l d er bal l posi t i o n des i gna t i o n per jep 9 5 , sect i o n 3 , spp-020 . " + " i nd i cates the the o ret i cal c e n t e r of d ep o p u l a t e d s o l d e r a 1 c o r n e r t o b e i d e n t i f i e d b y c h amf e r, la s e r or i n k m a r k 8 . 7 . 6 . no t es : 5 . 4 . 3 . 2 . 1 . a l l di m e n s i on s a r e i n m i l l i m e t e r s . s d b e e e d m e n 0 . 3 5 0 . 0 0 0 . 8 0 bs c 0 . 8 0 bs c 0 . 4 5 11 2 1 1 0 . 5 5 d i m e n s io n s d1 m d e 1 e d a a 1 s y m b o l 0 . 2 5 m i n . - 8 . 0 0 bs c 8 . 0 0 bs c 1 1 1 0 . 0 0 bs c 1 0 . 0 0 bs c n o m . - 1 . 4 5 0 . 4 5 m ax . s e 0 . 0 0 0 . 3 5 m e t a l i z e d m a r k , i n d e n t a t i o n o r o t h e r m e a n s. " s d " = e d / 2 a n d " s e " = e e / 2 . plane parallel t o d a t u m c . " s d " or " s e " = 0 . siz e md x m e . b a ll s . a 0 . 20 c 2 x b 0 . 20 c 2 x i n d e x ma rk pin a 1 c o rne r 7 1 2 3 4 5 6 7 8 9 1 0 1 1 a b c d e f g h j k l 11 2 x b 0 . 08 c a b 5 6 6 s i d e vie w 0 . 10 c c d e t a il a b o tt o m vie w t o p vie w d e t a i l a 10 . 00x10 . 00 x1.45 mm l b c 112 r ev * * package ou t line, 11 2 ball f b g a
document number: 002 - 05605 rev. *d page 102 of 109 mb9b100a series 16. errata this chapter describes the errata for mb9b100r series . details include errata trigger conditions, scope of impact, available workaround, and silicon revision applicability. contact your local cypress sales representative if you have questions. 16.1 part numbers affected part number initial revision mb9bf 1 0 2 rpmc - g - jne2 , mb9bf 1 0 4 rpmc - g - jne2 , mb9bf 1 0 5 rpmc - g - jne2 , mb9bf 1 0 6 rpmc - g - jne2 , mb9bf 1 0 2n pmc - g - jne2 , mb9bf 1 0 4n pmc - g - jne2 , mb9bf 1 0 5n pmc - g - jne2 , mb9bf 1 0 6n pmc - g - jne2 , mb9bf 1 0 2nbgl - ge1, mb9bf 1 0 4nbgl - ge1, mb9bf 1 0 5nbgl - ge1, mb9bf 1 0 6nbgl - ge1 16.2 qualification status product status: in production ? qual. 16.3 errata summary this table defines the errata applicability to available devices. items p art number silicon revision fix status [1] timer and s top mode i ssue refer to 16.1 rev. initial rev. fixed in rev. a [2] gap between watch counter value and real time at return in timer mode refer to 16.1 rev. initial rev. fixed in rev. a 16.4 errata detail 16.4.1 timer and s top m ode i ssue ? problem definition mcu does not return form timer or stop mode. ? parameters affected n/a ? trigger condition(s) the condition is that the timing of entering timer or stop mode and an interruption occurrence meet. ? scope of impact mcu does not return from time or stop mode. ? workaround this error cannot be avoided by any software, except not using timer and stop mode. ? fix status this issue was fixed in rev. a.
document number: 002 - 05605 rev. *d page 103 of 109 mb9b100a series 16.4.2 gap between watch counter value and real time at return in timer mode ? problem definition there is a gap between the value of the counter and the real time at the return by the interrupt in the sub - timer mode or the low speed cr timer mode. when the watch counter using the sub - crystal oscillator is used in the sub timer mode or the low speed cr timer mode, the value of the watch counter has a low speed cr x 35 clock delay (about 350 s at waiting for the stability of the regulator) at the return by the interrupt. as a result, a gap occurs between the value of the counter and the real time. the following figure shows the timing waveform . ? root cause the internal regulator operates with low drive and low power consumption in the sub tim er mode or the low speed cr timer mode. when the interrupt is requested, the mode of the internal regulator is switched to the normal drive mode. at this time, a swi tching time for the stability of the regulator is required. this mcu is designed for keepin g down the voltage variation of the regulator by reducing the current. to achieve it, the clock to the watch counter is stopped in the period. at a result, the value of the watch counter delay until the time for the stability of the regulator is shown in t he figure. therefore, a gap occurs between the value of the counter and the real time. ? trigger condition (s) when both of (1) and (2) described below is applicable, the gap occurs. (1) cpu operation mode the gap occurs in the sub timer mode or the low speed cr mode. it does not occur in the following mode s: ? run modes (pll, main, high speed cr, sub, and low speed cr) ? sleep modes (pll, main, high speed cr, sub, low speed cr) ? pll timer mode ? main timer mode ? high speed cr timer mode ? stop mode (2) return fac tor the gap occurs when any of the following interrupt is requested for the return in the sub timer mode or the low speed cr time r mode. ? nmi interrupt
document number: 002 - 05605 rev. *d page 104 of 109 mb9b100a series ? external interrupt ? hardware watchdog timer interrupt ? usb wakeup interrupt ? watch counter interrupt ? low - vol tage detection interrupt ? the gap does not occur in the standby return by the reset because the value of the counter is cleared ? workaround when the extremely accuracy is required for the count time of the watch counter, use the sub sleep mode or the low spe ed cr sleep mode. ? fix status this issue was fixed in rev. a.
document number: 002 - 05605 rev. *d page 105 of 109 mb9b100a series 17. major changes spansion publication number: ds706 - 00020 page section change results revision 1.0 - - initial release revision 1.1 - - company name and layout design change revision 2.0 3 features external bus interface added the description of maximum area size 8 packages deleted the description of es 17 list of pin functions list of pin numbers modified the pin state type of p4e from i to h 32 - 35 list of pin functions list of pin functions added lin to the description of sotxx 42 i/o circuit type added the description of i 2 c to the type of e and f 42, 43 i/o circuit type added about +b input 48 handling devices added " s tabilizing power supply voltage" 48 handling devices c rystal oscillator circuit added the following description "evaluate oscillation of your using crystal oscillator by your mount board." 49 handling devices c pin changed the description 50 block diagram modified the block diagram 50 memory size changed to the following description see "memory size" in "product lineup" to confirm the memory size. 51 memory map memory map(1) modified the area of "ext e rnal device area" 52 memory map memory map(2) added the summary of flash memory sector and the note 59, 60 electrical characteristics 1. absolute maximum ratings added the clamp maximum current added the output current of p80 and p81 added about +b input 61 electrical characteristics 2. recommended operation conditions modified the min imum value of analog reference voltage added smoothing capacitor added the note about less than the minimum power supply voltage 62, 63 electrical characteristics 3. dc characteristics (1) current rating changed the table format added main timer mode current added flash memory current moved a/d converter current 65 electrical characteristics 4. ac characteristics (1) main clock input characteristics added master clock at in t ernal operating clock frequency 66 electrical characteristics 4. ac characteristics (3) built - in cr oscillation characteristics added frequency stability time at built - in high - speed cr 67 electrical characteristics 4. ac characteristics (4 - 1)(4 - 2) operating conditions of main pll added main pll clock frequency added the figure of main pll connection 68 electrical characteristics 4. ac characteristics (6) power - on reset timing added time until releasing power - on reset changed the figure of timing
document number: 002 - 05605 rev. *d page 106 of 109 mb9b100a series page section change results 74 - 81 electrical characteri stics 4. ac characteristics (7) csio/uart timing modified from uart timing to csio/uart timing changed from internal shift clock operation to master mode changed from external shift clock operation to slave mode 88 electrical characteristics 5. 12bit a/d converter added the typical value of integral nonlinearity, differential nonlinearity, zero transition voltage and full - scale transition voltage added conversion time at avcc < 4.5v modified stage transition time to operation permission modified the minimum value of reference voltage 92 electrical characteristics 7. flash memory write/erase characteristics change to the erase time of include write time prior to internal erase 93 - 96 electrical characteristics 8. return time from low - pow er consumption mode added return time from low - power consumption mode 99 ordering information change to full part number 100 package dimensions deleted fpt - 100p - m20 and fpt - 120p - m21
document number: 002 - 05605 rev. *d page 107 of 109 mb9b100a series document history document title: mb9b100a series 32 - bit arm? cortex? - m3 fm3 microcontroller document number: 002 - 05605 revision ecn orig. of change submission date description of change ** - akih 12/15 /201 4 migrated to cypress and assigned document number 002 - 05605 . no change to document contents or format. *a 5213577 a kih 0 4 / 14 /201 6 updated to cypress format. *b 5486354 nosu 0 3 / 0 2 /201 7 changed the package codes in the following chapters as the table below. 2. packages 3. pin assignment 12.2. recommended operating conditions 14. ordering information 15. package dimensions . before after fpt - 100p - m23 lqi100 fpt - 120p - m37 lqm120 bga - 112p - m04 lbc112 changed a w o rd j - tag to jtag in 4. list of pin functions ( page 26 ). added a note of tap controller in 4. list of pin functions ( page 38 ). changed a word ta to t a in the following chapters. 12.2. recommended operating conditions ( page 59 ) 12.3. dc characteristics ( page 60 to 62 ) 12.4. ac characteristics ( page 63 to 86 ) 12.5. 12bit a/d converter ( page 87 ) 12.6. low - voltage detection characteristics ( page 90 ) 12.7. flash memory write/erase characteristics ( page 91 ) 12.8 return time from low - power consumption mode ( page 92 to 94 ) added the baud rate spec in 12.4.10 csio timing (page 73 , 75 , 77 , 79 ) corrected the following statement analog port input current ? analog port input leak current in chapter 12.5 12 - bit a/d converter ( page 87 ). corrected the following statement com r are clock cycle ? compare clock cycle in chapter 12.5 12 - bit a/d converter ( page 88 ). corrected the part numbers in chapter 14. ordering information . - mb9bf102nabgl - g - ye1 ? mb9bf102nabgl - g k6 e1 - mb9bf104nabgl - g - ye1 ? mb9bf104nabgl - g k6 e1 - mb9bf105nabgl - g - ye1 ? mb9bf105nabgl - g k6 e1 - mb9bf106nabgl - g - ye1 ? mb9bf106nabgl - g k6 e1 updated 15. package dimensions added 16. errata
document number: 002 - 05605 rev. *d page 108 of 109 mb9b100a series revision ecn orig. of change submission date description of change *c 5811604 ysat 07/1 3 /2017 adapted new cypress logo *d 5942095 hual 1 2 / 15 /2017 corrected the following clock frequency max value (when not trimming) 5mhz ? 6mhz in chapter 12.4.3 built - in cr oscillation characteristics . added the part numbers in chapter 14. ordering information . - mb9bf104napmc - g - une1 - mb9bf106napmc - g - une1 - mb9bf106rapmc - g - une1 corrected the part numbers in chapter 14. ordering information . - mb9bf106napmc - g - jne2 ? mb9bf106napmc - g - une2 - mb9bf106rapmc - g - jne2 ? mb9bf106rapmc - g - une2 added the errata 002 - 06782 contents in chapter 16. errata .
document number: 002 - 05605 rev. *d december 15, 2017 page 109 of 109 mb9b100a series sales, solutions, and legal information worldwide sales and design support cypress maintains a worldwide network of offices, solution centers, manufacturers representatives, and distrib utors. to find the office closest to you, visit us at cypress locations . products arm ? cortex ? microcontrollers cypress.com/a rm automotive cypress.com/automotive clocks & buffers cypress.com/clocks interface cypress.com/interface internet of things cypress.com/iot memory cypress.com/memory m icrocontrollers cypress.com/m cu psoc cypress.com/psoc power management ics cypress.com/p mic touch sensing cypress.com/touch usb controllers cypress.com/ usb wireless connectivity cypress.com/wireless psoc ? solutions psoc 1 | psoc 3 | psoc 4 | psoc 5lp | psoc 6 cypress developer community forums | wiced iot forums | projects | video | blogs | training | co mp onents technical support cypress.com/support a rm and cortex are registered trademarks of a rm limited (or its subsidiaries) in the u s and /or elsewhere . all other trademarks or registered trademarks referenced herein are the property of their respective owners. ? cypress semiconductor corporation, 2011 - 2017. this document is the property of cypress semiconductor corporation and its subsidiaries, including spansion llc (cypre ss). this document, including any software or firmware included or referenced in this document (software), is owned by cypress under the intellectual property laws and treaties of the united states and other countries worldwide. cypress reserves all rights under such laws and treaties and does not, except as specifically stated in this para graph, grant any license under its paten ts, copyrights, trademarks, or other intellectual property rights. if the software is not accompanied by a license agreement and you do not otherwise have a writ ten agreement with cypress governing the use of the software, then cypress hereby grants you a personal, non - exclusive, nontransferable license (without the right to sublicense) (1) under its copyright rights in the software (a) for s oftware provided in source code form, to modify and reproduce the software solely for use with cypress hardware prod ucts, only internally within your organization, and (b) to distribute the software in binary code form externally to end users (either directly or indirectly through resellers and distributors), solely for use on cypress hardware product unit s, and (2) und er those claims of cypresss patents that are infringed by the software (as provided by cypress, unmodified) to make, use, distribute, and import the software solely for use with cypress h ardware products. any other use, reproduction, modification, transl ation, or compilation of the software is prohibited. to the extent permitted by applicable law, cypress makes no warranty of any kind, express or implied, with regard to this doc ument or any software or accompanying hardware, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. no computing device can be absolutely secure. therefore, despite security measures implemented in cypress hardware or software products, cypress does not assume any liabilit y arising out of any security breach, such as unauthorized access to or use of a cypress product. in addition, the products described in these materials m ay contain design defects or errors known as errata which may cause the product to deviate from publi shed specifications. to the extent permitted by applicable law, cypress reserves the right to make changes to this document without further notice. cypress does not assume any liability arising out of the application or use of any product or circuit descr ibed in this document. any information provided in this document, including any sample design information or programming code, is provided only for reference purposes. it is the responsibility of the user of this document to prope rly design, program, and test the functionality and safety of any application made of this information and any resulting product. cypress products are not designed, intended, or authorized for use as cr itical components in systems designed or intended for the operation of weapon s, weapons systems, nuclear installations, life - support devices or systems, other medical devices or systems (including resuscitation equipment and surgical implants), pollu tion control or hazardous substances management, or other uses where the failure of the device or system could cause personal injury, death, or property damage (unintended uses). a critical component is any component of a device or system whose failure to perform can be reasonably expected to cause the failure of the device or system, or to affect its safety or effectiveness. cypress is not liable, in whole or in part, and you shall and hereby do release cypress from any claim, damage, or other liability arising from or r elated to all unintended uses of cypress products. you shall in demnify and hold cypress harmless from and against all claims, costs, damages, and other liabilities, including claims for personal i njury or death, arising from or related to any unintended uses of cypress products. cypress, the cypress logo, spansion, th e spansion logo, and combinations thereof, wiced, psoc, capsense, ez - usb, f - ram, and traveo are trademarks or registered trademarks of cypress in the united states and other countries. for a more complete list of cypress trademarks, visit cypress.com. ot her names and brands may be claimed as property of their respective owners.

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